Liquid Clamping Layer Capillary Flow Lithography Substrate
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Solution Overview
Problem
Existing substrate clamping methods in lithography systems face challenges in vacuum environments and heat management, with vacuum clamping being ineffective and electromechanical clamping interfering with charged particle lithography, and liquid clamping mechanisms having limited duration due to evaporation and condensation processes.
Innovation Solution
A substrate support structure using a liquid clamping layer with varying capillary potentials, induced by surface features such as channels and elevated structures, to create a capillary flow that maintains the clamping force over a longer period, while also enhancing heat dissipation through thermal contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If vacuum clamping is used to clamp substrate in vacuum environment, then clamping is effective, but this method will not be effective in vacuum environment
Solution Approach 1:
The patent replaces vacuum-based mechanical clamping with electromechanical clamping mechanisms that use electromagnetic forces to actuate clamping elements, enabling operation in vacuum environments where vacuum clamping is ineffective
Solution Approach 2:
The patent changes the operating parameters of the clamping system by using electromagnetic fields instead of pressure differential, allowing the clamping mechanism to function effectively in vacuum conditions where traditional vacuum clamping fails
2Reliability
If electromechanical clamping is used to clamp substrate in vacuum environment, then clamping is effective in vacuum, but electric fields interfere with charged particle lithography
Solution Approach 1:
The patent extracts and removes the electric field generation components from the clamping mechanism, eliminating the source of interference with charged particle lithography while maintaining vacuum compatibility through alternative non-electric field-based clamping methods
Solution Approach 2:
The patent introduces magnetic fields as an intermediary mechanism to achieve clamping in vacuum environments without using electric fields that would interfere with charged particle beams, utilizing magnetic actuation as a中介 between vacuum compatibility and lithography compatibility
3Duration of action of moving object
If liquid clamping layer is used to extend clamping duration, then clamping time is extended, but evaporation and condensation processes limit the duration
Solution Approach 1:
The patent utilizes controlled phase transitions of the liquid clamping layer, leveraging evaporation and condensation cycles in a closed system to maintain liquid presence and clamping force over extended periods, where evaporated liquid condenses and returns to the clamping interface
Solution Approach 2:
The patent establishes a continuous cycle where liquid evaporating from the clamping interface is condensed and returned, maintaining continuous liquid presence and clamping action without interruption, thereby extending operational duration despite phase change losses
4Reliability
If substrate support structure surface with bumps (burls) is used for clamping, then clamping is achieved, but contact area is limited and heat transport is restricted
Solution Approach 1:
The patent applies local quality changes by creating zones of different surface properties on the substrate support structure, with high-contact-area regions optimized for heat dissipation and other regions optimized for clamping, allowing simultaneous optimization of both functions
Solution Approach 2:
The patent transitions from point-contact clamping (burls) to distributed surface contact, adding dimensional coverage to the contact interface to simultaneously improve both clamping area and heat dissipation surface area
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution extends the clamping duration and improves heat management, allowing for more efficient and stable substrate processing in lithography systems by maintaining effective capillary forces and thermal contact, even under high energy loads.
Implementation Method 1
clamping a substrate by means of a capillary force created by a liquid clamping layer
Implementation Method 2
enhancing the thermal contact between the substrate and the substrate support structure surface
Data Source
AI summary
A substrate support structure for clamping a substrate by means of a capillary force created by a liquid clamping layer having a lower pressure than its surroundings. The substrate support structure comprises a surface provided with a plurality of substrate supporting elements for holding the substrate, and the surface further comprises portions with different capillary potential for inducing, during clamping, a predetermined capillary flow within the liquid clamping layer.