Liquid Cold Plate Layout for Uneven Heat Density Cooling
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Solution Overview
Problem
Conventional liquid-cooling heat dissipation systems for charging modules in new-energy vehicles face inefficiencies due to inconsistent heat dissipation capabilities across components with varying heat generation densities, leading to poor heat dissipation effects and resource wastage.
Innovation Solution
The implementation of a liquid cold plate with distinct cooling regions and varying densities of heat dissipation fins, along with a spoiler and thermal connection layers, to optimize heat dissipation based on the heat-generating components' densities, enhancing thermal conduction and exchange efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a liquid cold plate is used to cool multiple heat-generating components, then the heat dissipation capability is improved, but the energy consumption increases due to uniform cooling of all regions
Solution Approach 1:
The liquid cold plate is divided into multiple cooling regions with different cooling capabilities. The first cooling region has stronger cooling capability than the second cooling region, matching the different heat-generating densities of the first and second heat-generating components. This local differentiation allows each region to cool its corresponding component efficiently without wasting energy on regions with lower heat generation requirements.
2Device complexity
If uniform cooling is applied to all components, then the cooling system is simple, but heat dissipation efficiency decreases for high-density heat-generating components
Solution Approach 1:
The cooling system maintains relative simplicity while introducing local quality differentiation. The liquid cold plate is divided into multiple cooling regions with different cooling capabilities, allowing the system to handle components with different heat-generating densities efficiently. This localized approach improves heat dissipation efficiency without requiring a completely complex redesign of the cooling system.
3Power
If high-power cooling is applied to all regions, then the maximum heat dissipation capacity is achieved, but energy waste increases in low heat-generating regions
Solution Approach 1:
The liquid cold plate employs local quality differentiation where the first cooling region has stronger cooling capability than the second cooling region. This allows the system to apply high cooling power only where needed (first cooling region for high-density heat-generating component) while using lower cooling power in regions with lower heat generation requirements, thereby reducing energy waste.
Solution Approach 2:
The cooling system applies partial cooling action matched to the actual heat generation requirements of each component. Instead of applying excessive cooling power to all regions, the system provides just enough cooling capacity in each region to handle the corresponding component's heat generation, avoiding energy waste while maintaining adequate cooling performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves heat dissipation capabilities tailored to individual components, reducing energy consumption and resource wastage by optimizing the use of cooling medium flow and thermal connections.
Implementation Method 1
a first heat-generating component and a second heat-generating component disposed on the board, where a heat dissipation capability of the liquid cold plate is appropriately utilized to improve effects of dissipating heat for the first heat-generating component and the second heat-generating component
Implementation Method 2
A cooling working medium flows into the liquid cold plate from the liquid inlet, and flows out of the liquid cold plate from the liquid outlet. The cooling working medium first flows through the first cooling region from the liquid inlet, and then flows to the second cooling region
Data Source
Figure 1~3
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AI summary
This application provides an electronic assembly and an electronic device. The electronic assembly includes a circuit board assembly and a liquid cold plate. The circuit board assembly includes a board, a first heat-generating component, and a second heat-generating component, where the first heat-generating component and the second heat-generating component are disposed on the board. The liquid cold plate includes a liquid inlet and a liquid outlet. A cooling working medium flows into the liquid cold plate from the liquid inlet, and flows out of the liquid cold plate from the liquid outlet. The liquid cold plate includes a first cooling region and a second cooling region, where the second cooling region is closer to the liquid outlet than the first cooling region. The cooling working medium first flows through the first cooling region from the liquid inlet, and then flows to the second cooling region. A heat dissipation capability of the first cooling region is stronger than that of the second cooling region. A heat-generating density of the first heat-generating component is greater than that of the second heat-generating component, the first heat-generating component is thermally connected to the first cooling region, and the second heat-generating component is thermally connected to the second cooling region. In this way, a heat dissipation capability of the liquid cold plate is appropriately utilized to improve effects of dissipating heat for the first heat-generating component and the second heat-generating component and also reduce energy consumption.