Liquid Composition Adhesion to Metal Substrates
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Solution Overview
Problem
Existing liquid compositions used for forming electrically insulating layers on metal substrate layers in printed wiring boards face challenges in achieving excellent adhesion and toughness, particularly with finer wiring boards and smoother metal substrates.
Innovation Solution
A liquid composition comprising a thermosetting resin and silica particles with specific properties, such as water vapor adsorption amount, moisture retention variation, and particle size distribution, is developed to enhance adhesion and toughness of the cured product on metal substrate layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional liquid compositions are used for forming electrically insulating layers on metal substrate layers, then the basic insulation function is achieved, but the adhesion between the cured product and the metal substrate layer is insufficient
Solution Approach 1:
The patent changes the chemical composition parameters of the liquid composition by introducing a specific silane coupling agent and controlling the ratio of inorganic filler to organic resin. This parameter optimization enables the cured product to achieve excellent adhesion to metal substrate layers while maintaining ease of manufacture through standard manufacturing processes.
Solution Approach 2:
The patent creates a composite liquid composition system combining silane coupling agents, inorganic fillers, and organic resins. This composite approach allows the cured product to exhibit both excellent adhesion properties and ease of manufacture, as the composite formulation addresses multiple performance requirements simultaneously.
2Manufacturing precision
If the metal substrate layer surface is made smoother for finer wiring boards, then the wiring board precision is improved, but the adhesion of the cured product to the metal substrate layer deteriorates
Solution Approach 1:
The silane coupling agent acts as an intermediary substance between the smooth metal substrate surface and the organic resin. It chemically bonds to both the metal surface and the resin, creating a strong interfacial connection that maintains excellent adhesion even when the metal substrate surface is made smoother for finer wiring boards.
Solution Approach 2:
The patent modifies the chemical parameters of the liquid composition by incorporating silane coupling agents and controlling the inorganic filler to organic resin ratio. This parameter change enables the composition to maintain excellent adhesion to smooth metal surfaces while supporting high manufacturing precision requirements.
3Strength
If silica particles are added to the liquid composition to improve toughness, then the cured product toughness is improved, but the dispersibility of silica particles and mixing operability deteriorate due to wall attachment and foaming
Solution Approach 1:
The silane coupling agent serves as an intermediary that prevents direct aggregation of silica particles and reduces wall attachment during mixing. It acts as a bridge between the inorganic silica particles and the organic resin matrix, enabling uniform dispersion and improving mixing operability while maintaining the toughness benefits of silica addition.
Solution Approach 2:
The patent optimizes the chemical parameters of the liquid composition by controlling the ratio of inorganic filler to organic resin and adding silane coupling agents. These parameter changes prevent silica particle aggregation and wall attachment, improving dispersibility and mixing operability while preserving the toughness enhancement from silica particles.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed liquid composition and prepreg system achieve excellent adhesion and toughness of the cured product on metal substrate layers, addressing the limitations of conventional systems and improving the reliability of wiring boards.
Implementation Method 1
it has become increasingly important to use liquid compositions comprising a silane coupling agent and an inorganic filler and an organic resin, in order to achieve excellent adhesion of a cured product to a metal substrate layer
Implementation Method 2
liquid compositions comprising a silane coupling agent and an inorganic filler and an organic resin... excellent dispersibility of the inorganic filler particles
Data Source
AI summary
Provided are: a liquid composition containing a thermosetting resin and silica particles, the silica particles (1) having a specific water vapor adsorption amount and a specific moisture retention variation, (2) having a specific charge amount and a specific d50, and (3) having a specific powder friction angle, a specific d50, and a specific aggregation state; a prepreg, a metal substrate with a resin, and a wiring board using the liquid composition; and silica particles used in the liquid composition.