Liquid Coolant Heat Pipe Retainer for Pluggable Module Thermal Management
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Solution Overview
Problem
Air-cooled solutions are insufficient for managing thermal energy generated by high-performance computing systems, particularly for pluggable circuit modules that exceed the cooling capacity of air-cooled systems and are constrained by inadequate contact pressures and container size limitations.
Innovation Solution
A heat pipe and retainer system is physically and thermally attached to a container to facilitate liquid coolant flow for thermal energy management, with a retainer having sufficient tensile strength to withstand repeated module insertions and removals, and a cold plate with liquid coolant to enhance thermal conduction paths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If air-cooled solutions are used for thermal energy management, then the system structure is simple and ease of manufacture is improved, but the cooling capacity is insufficient for high-power-density computing systems
Solution Approach 1:
The patent transitions from air-cooled (gas-based) to liquid-cooled (hydraulic) thermal management systems. Liquid coolant flows through channels in contact with heat-generating components, providing superior heat transfer capacity and cooling performance for high-power-density computing systems while maintaining manufacturing feasibility
2Power
If liquid coolant based thermal energy management is implemented, then the cooling capacity and thermal energy management effectiveness are improved, but the device complexity increases
Solution Approach 1:
The liquid cooling system is integrated within the container structure itself, with cooling channels nested inside the container walls and components. This nested design incorporates the cooling function into the existing structural elements, providing enhanced cooling capacity while minimizing additional device complexity
Solution Approach 2:
The container structure serves multiple functions: it provides mechanical support, houses pluggable circuit modules, and simultaneously acts as part of the liquid cooling system through integrated cooling channels. This multi-functionality reduces overall device complexity by combining structural and thermal management roles
3Adaptability or versatility
If pluggable circuit modules are repeatedly inserted and removed, then the adaptability and versatility are improved, but the thermal attachment degradation occurs due to insufficient retainer tensile strength
Solution Approach 1:
The retainer mechanism is designed with dynamic characteristics to accommodate repeated insertion and removal operations. The retainer maintains adequate contact pressure and thermal attachment during module operations, with sufficient tensile strength to withstand cyclic mechanical stresses without degradation below design thresholds
Solution Approach 2:
The retainer is pre-configured with sufficient tensile strength and mechanical properties before module installation. This preliminary design ensures that the thermal attachment remains intact throughout the module's operational lifecycle, preventing degradation from occurring in the first place
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively cools high thermal energy outputs up to 10 watts to 70°C, maintaining performance across multiple insertion cycles and accommodating various pluggable circuit modules, thereby overcoming the limitations of air-cooled solutions.
Implementation Method 1
a heat pipe to facilitate a liquid coolant flow to remove thermal energy from a plurality of pluggable circuit modules
Implementation Method 2
heat pipe to facilitate a liquid coolant flow
Implementation Method 3
a cold plate with liquid coolant to enhance thermal conduction paths
Data Source
AI summary
Embodiments include apparatuses, methods, and systems for managing thermal energy of a computing device. An apparatus may include a heat pipe physically and thermally attached to a container by a retainer. The container may include a plurality of slots to removably receive various plurality of pluggable circuit modules during a lifetime of the container. The heat pipe may facilitate a liquid coolant flow to remove thermal energy from a plurality of pluggable circuit modules removably received into the plurality of slots of the container. The retainer may have a tensile strength sufficient to withstand repeated receiving and removal of the various plurality of pluggable circuit modules during the lifetime of the container, without degrading the thermal attachment of the heat pipe to the container below a design performance threshold. Other embodiments may also be described and claimed.