Liquid Coolant Conduit in Memory Socket for Heat Removal
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Solution Overview
Problem
The increasing heat generation from memory modules in computer systems poses challenges for traditional air cooling methods, which become costly and inefficient, especially when trying to cool high heat flux microprocessors and large amounts of on-board memory, as they require increased airflow and additional equipment for liquid cooling, making it difficult to allocate sufficient space within computer servers.
Innovation Solution
A liquid cooling apparatus comprising a liquid coolant conduit with a conduit support structure that fits within a memory module socket, a heat pipe extending laterally to adjacent sockets, and a heat spreader assembly with thermally conductive plates for direct thermal contact with memory modules, allowing for efficient heat transfer and reduced space requirements, enabling the cooling of multiple memory modules without extending above them.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional air cooling methods are used to cool memory modules, then the cooling system is simple to implement, but the cooling efficiency becomes insufficient as heat generation increases
Solution Approach 1:
The patent introduces liquid coolant as an intermediary substance to transfer heat from memory modules. The coolant circulates through conduits positioned near the memory modules, absorbing heat and transporting it to external heat exchangers, thereby achieving superior cooling efficiency compared to direct air cooling while maintaining system simplicity.
Solution Approach 2:
The patent employs liquid hydraulic cooling systems where coolant flows through closed-loop conduits to remove heat from memory modules. This hydraulic approach provides controlled, efficient heat removal that scales with increasing heat flux densities, overcoming the limitations of air cooling while avoiding complex mechanical intervention.
2Reliability
If liquid cooling equipment is added to cool memory modules, then cooling efficiency improves, but the space required within the server increases
Solution Approach 1:
The patent positions coolant conduits in the vertical space above and below memory modules rather than requiring additional horizontal space. The conduits are routed through available vertical clearance in the server chassis, allowing liquid cooling integration without increasing the server's footprint or compromising component density.
Solution Approach 2:
The liquid cooling system is designed to serve multiple functions: cooling memory modules, microprocessors, and other high-heat components through a unified coolant circulation system. This multi-functional approach consolidates cooling requirements into a single infrastructure, reducing overall space requirements compared to dedicated cooling systems for each component.
3Reliability
If increased airflow is used to cool memory modules, then heat removal capacity increases, but energy consumption and system cost increase
Solution Approach 1:
The patent replaces mechanical air moving systems (fans, blowers) with a liquid-based heat transfer system. The liquid coolant passively absorbs and transports heat through circulation, eliminating or reducing the need for high-power air moving devices. This substitution dramatically reduces energy consumption while maintaining or improving heat removal capacity.
Solution Approach 2:
The patent utilizes hydraulic liquid cooling to transfer heat from memory modules, replacing pneumatic air cooling methods. The liquid coolant circulates through conduits positioned near heat-generating components, providing efficient heat removal with minimal energy input compared to high-velocity airflow systems requiring substantial fan power.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively manages heat dissipation from memory modules by circulating a liquid coolant and using heat pipes and spreader assemblies to transfer heat efficiently, reducing the need for increased airflow and additional equipment, thus addressing the limitations of traditional cooling methods while maintaining a compact design.
Implementation Method 1
a liquid coolant conduit adapted for circulating a liquid coolant between an liquid inlet end and a liquid outlet end
Implementation Method 2
a first heat pipe having a first portion in direct thermal contact with the liquid conduit, wherein the first heat pipe extends laterally from the liquid coolant conduit
Implementation Method 3
a first heat spreader assembly in direct thermal contact with the second portion of the first heat pipe, wherein the first heat spreader assembly includes a first thermally conductive plate disposed for direct thermal contact with a first face of a first memory module
Data Source
AI summary
An apparatus for cooling a memory module installed in a computer system includes a liquid coolant conduit that is connected to a conduit support structure having a form factor selectively securable within a first preconfigured memory module socket of the computer system in order to position the liquid coolant conduit above the first socket. A heat pipe provides direct thermal contact between the liquid conduit and a heat spreader assembly in direct thermal contact with a face of the memory module. The apparatus may include a second heat pipe and second heat spreader assembly for similarly cooling a second memory module. In alternative configurations, the apparatus may cool memory modules on opposing sides of the conduit or memory modules that are both on the same side of the conduit.