Liquid-Cooled Electromagnetic Bobbin Layout for Higher Power Density
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Solution Overview
Problem
Existing liquid cooled power electronic units for electric and hybrid vehicles face inefficiencies in heat dissipation, leading to overheating and adverse effects such as short circuits and core degradation, due to limited cooling of electromagnetic components, particularly in central regions, which restricts power density and increases weight and volume.
Innovation Solution
The proposed light liquid cooled power electronic unit incorporates intermediate cooling regions within the bobbins of electromagnetic components and a first flat manifold in the cooling circuit, allowing close contact and efficient heat transmission, reducing the need for coolant and simplifying manufacturing, while maximizing power density and reducing weight.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If power density is increased by introducing higher densities of electric current in electromagnetic components, then power per unit volume is improved, but heat losses increase and temperature rises, leading to overheating and component failure
Solution Approach 1:
The cooling circuit is segmented into multiple independent channels, each serving specific electromagnetic components. This segmentation allows targeted cooling of high-heat-generation zones while maintaining efficient heat evacuation across the entire power electronic unit, resolving the contradiction between high power density and temperature control
Solution Approach 2:
The cooling channels are integrated within the structural walls of the power electronic unit, with the first wall containing a first flat manifold and the second wall containing a second flat manifold. This nesting approach embeds the cooling system within the existing structure, enabling efficient heat dissipation without increasing overall unit volume, thus maintaining high power density while controlling temperature
2Temperature
If conventional cooling circuits are used with external envelopment of electromagnetic components, then external cooling is improved, but manufacturing complexity increases and central regions remain under-cooled
Solution Approach 1:
The cooling circuit is merged with the structural walls of the power electronic unit. The first wall and second wall each contain integrated cooling manifolds and channels, combining the structural support function with the thermal management function. This integration simplifies manufacturing by eliminating separate cooling housings while ensuring comprehensive cooling of electromagnetic components including central regions
Solution Approach 2:
The cooling approach transitions from external envelopment to internal integration. Instead of placing cooling channels outside the electromagnetic components, the channels are positioned within the walls that directly contact the components, enabling heat evacuation from all surfaces including central regions through the integrated wall structures
3Weight of moving object
If cooling circuit volume is reduced to decrease weight, then weight is improved, but heat dissipation efficiency may be compromised
Solution Approach 1:
The cooling circuit utilizes thin-walled structures with integrated cooling channels. The first wall and second wall are designed as thin structural elements containing manifolds and channels, minimizing the volume and weight of the cooling circuit while maintaining sufficient surface area for effective heat dissipation, thus resolving the contradiction between weight reduction and heat dissipation efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat dissipation, stabilizes component temperatures, increases power density, and reduces weight and volume, thereby preventing overheating and improving the efficiency and reliability of power electronic units.
Implementation Method 1
several intermediate cooling regions, each intermediate cooling region being in close contact with one of said several electromagnetic components, allowing heat transmission by conduction between the electromagnetic components and the intermediate cooling regions
Implementation Method 2
a cooling circuit with a liquid inlet, a liquid outlet, and several intermediate cooling regions
Data Source
AI summary
Light liquid cooled power electronic unit comprising several electromagnetic components (10), a cooling circuit (20) with several intermediate cooling regions (23), each in close contact with one electromagnetic component (10), allowing heat transmission by conduction; and a first wall (31) the first wall (31) containing at least a first flat manifold (21) constitutive of a portion of the cooling circuit (20); wherein each intermediate cooling region (23) of the cooling circuit (20) is defined within a bobbin (13) interposed between an electroconductive coil (12) and a magnetic core (11) of each electromagnetic component (10); the first flat manifold (21) including first connection openings (41) oriented towards the electromagnetic components (10), each intermediate cooling region (23) of the cooling circuit (20) being tightly connected to the first flat manifold (21) through the first connection openings (41) by a fitting perpendicular to a main surface of the first wall (31).