Liquid-Cooled Busbar Assembly for Higher Current in Compact Packaging

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Solution Overview

Problem

Existing busbar assemblies in electrical devices generate excessive heat, leading to potential damage and requiring increased size to manage temperature, which increases costs and has practical limitations.

Innovation Solution

A busbar assembly with integrated thermal conduits allowing liquid coolant to flow through, effectively dissipating heat from the busbars, thereby reducing operating temperatures and enabling higher current capacity without the need for larger components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If the size of the busbar assembly is increased to improve current carrying capacity and lower operating temperature, then the current carrying capacity is improved and operating temperature is reduced, but the cost increases and the system integration becomes more difficult

Engineering Contradiction:

Improveoperating temperatureVSAvoidsystem integration complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The cooling system is merged with the busbar assembly by integrating coolant channels directly into the busbar structure. The busbar assembly includes a first busbar with a first coolant channel and a second busbar with a second coolant channel, allowing the cooling function to be combined with the power transmission function in a single integrated component, thereby reducing system complexity while maintaining effective cooling

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The coolant channels are nested within the busbar structure itself. The first coolant channel is formed in the first busbar and the second coolant channel is formed in the second busbar, creating a nested configuration where the cooling pathway is embedded inside the power-conducting element, achieving space-efficient integration without increasing overall system footprint

Inventive Principle:

Principle #7Nested doll (Nesting)

2Power

If the size of the busbar assembly is increased to improve current carrying capacity, then the current carrying capacity is improved, but the cost increases

Engineering Contradiction:

Improvecurrent carrying capacityVSAvoidmanufacturing cost

Core Design Contradiction:

PowerVSEase of manufacture

Solution Approach 1:

The cooling function is merged with the busbar structure, allowing the same component to serve dual purposes: power transmission and heat dissipation. This integration eliminates the need for separate cooling components, reducing material usage and manufacturing complexity while maintaining high current carrying capacity through efficient thermal management

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The busbar assembly incorporates controlled thermal conductivity variations through the integration of coolant channels. By changing the thermal parameters of the busbar structure (adding fluid-cooled pathways), the system achieves enhanced heat dissipation capability without increasing the physical dimensions of the busbars, thereby maintaining cost-effectiveness while improving power handling capacity

Inventive Principle:

Principle #35Parameter changes

3Temperature

If liquid cooling is implemented to dissipate heat from the busbar assembly, then the operating temperature is reduced, but the device complexity increases

Engineering Contradiction:

Improvebusbar operating temperatureVSAvoidcooling system complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The busbar assembly serves multiple functions simultaneously: it transmits electrical power and provides thermal management. The integrated coolant channels enable the busbar to perform both power conduction and heat dissipation functions, reducing the need for separate dedicated cooling components and simplifying the overall system architecture

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The liquid cooling system efficiently dissipates heat from the busbar assembly, allowing it to operate at lower temperatures and handle higher currents while maintaining a compact design, reducing costs and preventing damage from elevated temperatures.

Implementation Method 1

a first thermal conduit extending along the first busbar that allows liquid coolant to flow therethrough to dissipate heat from the first busbar

Methodology Applied

Scientific EffectHeat transfer: Convection

Implementation Method 2

a first thermal conduit extending along the first busbar that allows liquid coolant to flow therethrough to dissipate heat from the first busbar

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS12178019B2Coolant system for a busbar assembly

Publication Date: 2024.12.24 TYCO ELECTRONICS (SHANGHAI) CO LTD

AI summary

A busbar assembly includes a first busbar having a mating interface for mating with an electrical component to power the electrical component and a second busbar having a mating interface for mating with the electrical component to power the electrical component. The busbar assembly includes a first thermal conduit extending along the first busbar that allows liquid coolant to flow therethrough to dissipate heat from the first busbar. The busbar assembly includes a second thermal conduit extending along the second busbar that allows liquid coolant to flow therethrough to dissipate heat from the second busbar.