Liquid-Cooled Cabinet With Flow Equalizing Plate

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Solution Overview

Problem

Data center computer rooms face high energy consumption and inefficient power usage due to air-cooled refrigeration systems, which fail to effectively manage the increasing heat generated by densely integrated electronic devices.

Innovation Solution

A liquid-cooled cabinet and data center computer room design that utilizes an inner liner with a flow equalizing plate, coolant cavity, and a system of inlets and outlets to circulate coolant for efficient heat dissipation, reducing energy consumption and improving power usage effectiveness (PUE).

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If air-cooled air conditioners are used for refrigeration, then the computer room can be cooled down, but energy consumption increases and PUE deteriorates

Engineering Contradiction:
Improvecomputer room temperatureVSAvoidenergy consumption
Core Design Contradiction:
TemperatureVSUse of energy by moving object

Solution Approach 1:

The patent replaces air-cooled refrigeration with liquid-cooled refrigeration systems. Liquid cooling circuits are installed within the cabinet to directly cool electronic devices, achieving superior heat dissipation efficiency compared to air cooling. This hydraulic approach reduces energy consumption while maintaining effective temperature control in the computer room.

Inventive Principle:
Principle #29Pneumatics and hydraulics

Solution Approach 2:

The patent substitutes traditional mechanical air conditioning systems with a liquid cooling system that uses coolant circulation through heat exchange. The liquid cooling system includes coolant channels, pumps, and heat exchangers that replace the mechanical compression and air circulation of conventional AC systems, resulting in lower energy consumption and improved PUE.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Productivity

If integration density of electronic devices is increased, then processing capacity improves, but heat dissipation becomes more difficult

Engineering Contradiction:
Improveprocessing capacityVSAvoidheat dissipation
Core Design Contradiction:
ProductivityVSTemperature

Solution Approach 1:

The patent implements liquid cooling circuits that directly contact or closely approach electronic devices with high integration density. The liquid coolant flows through channels positioned to maximize heat extraction from densely packed components, effectively managing the increased heat generation from higher processing capacity while maintaining operational temperatures.

Inventive Principle:
Principle #29Pneumatics and hydraulics

3Ease of manufacture

If air cooling is used, then the system is simple to implement, but power usage efficiency (PUE) fails to meet requirements

Engineering Contradiction:
Improvesystem implementation simplicityVSAvoidpower usage efficiency
Core Design Contradiction:
Ease of manufactureVSLoss of energy

Solution Approach 1:

The patent employs liquid cooling systems with integrated coolant circulation circuits that can be installed within standard cabinet structures. While slightly more complex than air cooling, the system provides dramatically improved PUE through direct liquid-to-device heat exchange, efficient heat removal, and reduced refrigeration load on ambient air conditioning systems.

Inventive Principle:
Principle #29Pneumatics and hydraulics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The liquid-cooled system significantly reduces power consumption, noise pollution, and water usage while ensuring precise temperature control and minimizing environmental impact compared to air cooling methods.

Implementation Method 1

the coolant enters the main body of the electronic device through the second through-hole and takes away heat generated by the electronic device

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a flow equalizing plate, where a coolant cavity for coolant injection is formed between the flow equalizing plate and a bottom surface of the accommodation chamber, the flow equalizing plate is provided with multiple rows of first through-holes for a coolant to pass through

Methodology Applied
Scientific EffectFluid flow distribution: Convection

Data Source

PatentUS20240215199A1Liquid-cooled cabinet and data center computer room
Publication Date: 2024.06.27 HEBEI QINHUAI DATA CO LTD
  • US20240215199A1 patent drawing
  • US20240215199A1 patent drawing
  • US20240215199A1 patent drawing

AI summary

A liquid-cooled cabinet and a data center computer room are disclosed. The liquid-cooled cabinet includes an inner liner having an open accommodation chamber internally provided with a flow equalizing plate, a coolant cavity is formed between the flow equalizing plate and a bottom surface of the accommodation chamber, and the flow equalizing plate is provided with multiple rows of first through-holes. A drainage portion is arranged on a bottom of the first sidewall and a bottom of the second sidewall, and a splitter cavity is arranged below the drainage portion, where a top surface of the splitter cavity is flush with the flow equalizing plate, and the liquid inlet leads to the drainage portion. A liquid outlet is also arranged on the first sidewall and the second sidewall. The liquid-cooled cabinet also includes a top cap that fits in size to an opening of the accommodation chamber.