Liquid-Cooled Case Jet Cooling Flow Guide Blocks
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Solution Overview
Problem
Current heat dissipation methods in data centers, such as water cooling and air cooling, are inefficient and pose safety hazards, and existing liquid cooling systems struggle to meet the demands of high-power electronic equipment due to non-uniform heat dissipation and high maintenance costs.
Innovation Solution
A liquid-cooled case employing a jet cooling technique with flow guide blocks of specific shapes (cosinusoidal, cycloidal, parabolic, concave, square, and triangular) to uniformly disperse cooling liquid and improve heat dissipation efficiency, combined with a closed-loop circulatory system for efficient heat management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If water cooling or air cooling is used, then heat dissipation can be achieved, but heat dissipation efficiency is insufficient and safety hazards occur due to direct contact between electronic elements and water
Solution Approach 1:
The patent introduces a liquid medium as an intermediary between the electronic components and the cooling system. The liquid circulates through channels in contact with heating components, transferring heat without direct contact with electronic elements, thus ensuring safety while improving heat dissipation efficiency through controlled thermal transfer.
Solution Approach 2:
The cooling system is segmented into distinct functional zones: liquid inlet channels, heating component contact zones, liquid outlet channels, and electronic component zones. This segmentation allows heat transfer through controlled liquid flow paths while isolating electronic elements from direct liquid contact, resolving the contradiction between safety and efficiency.
2Productivity
If chips are mounted on main boards arranged on both sides to increase density, then processing capacity increases, but maintenance cost increases due to need to remove all chips when replacing main boards
Solution Approach 1:
The system segments the cooling function from the main board structure by providing independent liquid cooling channels that contact only the heating components. This allows individual component replacement without affecting the entire main board assembly, reducing maintenance costs while maintaining high processing capacity through dual-sided board configuration.
Solution Approach 2:
The cooling function is extracted as a separate system with dedicated liquid channels that can independently service heating components on either main board. This extraction allows maintenance of individual components without requiring removal of all chips or disassembly of the entire board structure.
3Loss of energy
If conventional cooling methods with radiators, fans, and protecting covers are used, then heat dissipation can be achieved, but device complexity increases
Solution Approach 1:
The patent merges the cooling liquid circulation function directly into the case structure by integrating liquid channels within the case walls. This consolidation eliminates the need for separate radiators, fans, and protecting covers, reducing device complexity while maintaining effective heat dissipation through the integrated liquid cooling system.
Solution Approach 2:
The case structure serves multiple functions simultaneously: it provides mechanical protection for electronic components and houses the liquid cooling channels for heat dissipation. This multi-functionality eliminates the need for separate dedicated cooling components, reducing overall system complexity while maintaining heat dissipation capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces cooling liquid consumption, ensures uniform heat dissipation, lowers maintenance and processing costs, and enhances the heat exchange efficiency by using a closed-loop circulatory system with flow guide blocks that direct the cooling liquid to heat sources, improving the overall heat dissipation performance.
Implementation Method 1
Heat generated by the electronic equipment is effectively transferred to the immersing liquid
Implementation Method 2
the circulating process of the external cooling medium in the cooling case is realized through the liquid inlet branch and the liquid outlet branch
Data Source
AI summary
Provided is a liquid-cooled case which can disperse a cooling liquid by means of a jet cooling technique in an immersed system to dissipate heat uniformly and improve the heat dissipating efficiency. The liquid-cooled case includes cover plates; main boards; a liquid inlet unit, wherein the liquid inlet unit includes a liquid inlet tube and a liquid inlet, the liquid inlet is formed in the case, and one end of the liquid inlet tube is imported into the case through the liquid inlet; and a liquid outlet unit, wherein the liquid outlet unit includes a liquid outlet tube and a liquid outlet, the liquid outlet is formed in the case, and one end of the liquid outlet tube is exported out of the case through the liquid outlet. The liquid-cooled case further includes flow guide blocks which are arranged on the cover plates or the main boards.