Liquid-Cooled On-Board Charger Layout for Higher Power Density
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Solution Overview
Problem
Conventional on-board chargers have low power density and poor space utilization due to their bulky structure and inefficient heat dissipation, with magnetic components not optimally matched, leading to increased size and reduced heat dissipation performance.
Innovation Solution
The design incorporates a housing with a multi-layer structure for electronic components and fluid channels, allowing for efficient heat dissipation and compact layout, with fluid channels integrated into the sidewalls to reduce width and enhance power density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional on-board charger structure is used, then the device is easy to manufacture, but the space utilization is poor and the size is large
Solution Approach 1:
The charger is divided into multiple functional modules including a first module with AC input circuitry and rectifier, a second module with DC-DC converter and magnetic components, and a third module with control circuitry. Each module is independently arranged and can be manufactured separately, then assembled together. This segmentation allows for optimized space utilization in each module while maintaining manufacturing simplicity through modular assembly.
Solution Approach 2:
The patent utilizes three-dimensional space arrangement by stacking modules vertically and horizontally within the housing. The first, second, and third modules are positioned at different levels and orientations, maximizing space utilization. The liquid cooling channels are also arranged in three dimensions, wrapping around magnetic components and extending through multiple module levels, thereby reducing the overall charger volume while maintaining ease of manufacture through standardized module designs.
2Volume of moving object
If magnetic components are selected from existing product libraries, then the selection process is simple, but the space utilization cannot be improved and heat dissipating performance is poor
Solution Approach 1:
The patent integrates the liquid cooling structure with the magnetic components by forming cooling channels that wrap around the magnetic components and are in direct thermal contact. This merging of cooling function with magnetic component housing eliminates the need for separate cooling attachments, reducing overall space while improving heat dissipation. The magnetic components are custom-designed to fit specific spaces within the second module, optimizing space utilization rather than using standard off-the-shelf components.
Solution Approach 2:
The patent implements localized cooling channels that are specifically positioned around high-heat-generating magnetic components. The cooling channel cross-sections are varied in different regions to match the local heat generation patterns of different magnetic components. This localized approach optimizes heat dissipation efficiency for each component while maintaining compact overall dimensions, and the custom-designed magnetic components are selected to fit specific optimized spaces rather than using generic library components.
3Length of moving object
If inlet tube and outlet tube are disposed outside the housing, then the connection is simple, but the width of the on-board charger cannot be reduced
Solution Approach 1:
The inlet and outlet tubes are nested within the housing structure by integrating them into the liquid cooling channels that are already inside the modules. The cooling channels are formed within the housing walls and module casings, with inlet and outlet openings positioned on the housing exterior. This nesting approach eliminates the need for separate external tubes, reducing charger width while the modular channel design maintains manufacturing simplicity through standardized cooling structure components.
4Power
If conventional layout is used, then the design process is straightforward, but the power density is low
Solution Approach 1:
The charger is divided into multiple functional modules including a first module with AC input circuitry and rectifier, a second module with DC-DC converter and magnetic components, and a third module with control circuitry. Each module is independently arranged and can be manufactured separately, then assembled together. This segmentation allows for optimized space utilization in each module while maintaining manufacturing simplicity through modular assembly.
Solution Approach 2:
The patent utilizes three-dimensional space arrangement by stacking modules vertically and horizontally within the housing. The first, second, and third modules are positioned at different levels and orientations, maximizing space utilization. The liquid cooling channels are also arranged in three dimensions, wrapping around magnetic components and extending through multiple module levels, thereby reducing the overall charger volume while maintaining ease of manufacture through standardized module designs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances space utilization, reduces volume, and increases power density by optimizing the arrangement of electronic components and heat dissipation areas within the charger.
Implementation Method 1
The fluid channel is in communication between the inlet tube and the outlet tube, and configured for allowing the liquid to flow through the electronic components inside the on-board charger, so that heat dissipation is performed
Data Source
AI summary
The present disclosure provides an on-board charger. The on-board charger includes a housing, a connection channel, a circuit board assembly, and a plurality of electronic components. The housing includes an accommodation space. The accommodation space includes a heat dissipating area, the heat dissipating area includes an upper layer, a fluid channel layer, and a lower layer. A fluid channel is formed inside the fluid channel layer. The connection channel is in communication with the first fluid channel. The circuit board assembly includes an upper substrate and a lower substrate. A part of the upper substrate is disposed in the upper layer, and a part of the first lower substrate is disposed in the first lower layer. The plurality of electronic components are disposed corresponding to the circuit board assembly.