Liquid-Cooled Server Chassis Layout for Leak-Safe Port Integration
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Solution Overview
Problem
Existing liquid cooling systems for supercomputing servers have complex piping arrangements and inadequate reliability, leading to inconvenient installation and potential liquid leakage.
Innovation Solution
A simplified liquid cooling piping structure for supercomputing servers, featuring a chassis with an accommodating space and protective space, where medium ports extend through slots in the side panel and are protected by a liquid barrier strip, reducing the risk of leakage and enhancing operational reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If complex liquid cooling piping arrangement is used, then cooling effectiveness is improved, but device complexity and installation difficulty increase
Solution Approach 1:
The patent merges the liquid cooling piping with the chassis structure by integrating the piping into the side panels and base plate. The first medium port and second medium port are directly formed in the first side panel, eliminating the need for separate external piping connections and reducing overall system complexity while maintaining cooling effectiveness.
Solution Approach 2:
The side panels serve multiple functions: they provide structural support for the chassis, contain slots for medium port passage, and integrate the cooling piping system. The first side panel acts as both a structural component and a fluid conduit, reducing the number of separate components needed.
2Reliability
If complex liquid cooling piping arrangement is used, then cooling effectiveness is improved, but ease of installation deteriorates
Solution Approach 1:
By combining the piping system with the chassis structure, the patent reduces the number of separate installation steps. The medium ports are directly formed in the side panel, allowing for simpler connection to external cooling systems without requiring complex piping assembly.
Solution Approach 2:
The chassis is divided into modular components (side panels, base plate, cover plate) with the cooling piping integrated into specific segments. This segmentation allows for easier assembly and disassembly, improving installation convenience while maintaining the integrity of the cooling system.
3Ease of operation
If liquid cooling piping extends through side panel slots, then accessibility is improved, but risk of liquid leakage increases
Solution Approach 1:
The patent introduces an intermediary sealing structure at the interface where the medium ports pass through the side panel slots. This sealing mechanism prevents liquid leakage while allowing the ports to extend through the slots for external accessibility, resolving the contradiction between accessibility and leakage resistance.
4Reliability
If protective space is added for medium ports, then reliability against external damage is improved, but device complexity increases
Solution Approach 1:
The protective space is merged with the existing chassis structure by extending the side panels and base plate to form a protective enclosure around the medium ports. This integration provides protection without requiring additional separate protective components, thus avoiding increased device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a simple, easy-to-assemble structure that prevents leakage and improves assembly efficiency while ensuring high operational reliability and effective heat dissipation.
Implementation Method 1
Liquid cooling is a method that utilizes a coolant to remove heat generated by numerous high-performance chips operating inside the supercomputing server, by means of heat exchange.
Data Source
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AI summary
Disclosed are a supercomputing server and a data center. The supercomputing server includes a chassis and a liquid-cooled module. The chassis includes a cover plate, a base plate, and a first side panel, a second side panel, a third side panel and a fourth side panel that are sequentially end-to-end connected. The side panels are connected to the base plate and extend from a same surface thereof to form an accommodating space with the base plate. The base plate, the second side panel, and the fourth side panel each extend beyond the first side panel to form a protective space. A first slot and a second slot are arranged in the first side panel. The cover plate covers the accommodating space. The liquid-cooled computing module has a first end wall, a first medium port, and a second medium port.