Liquid-Cooled Electronic Device: Parallel Rails for Modular Maintenance
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Solution Overview
Problem
Conventional liquid cooled electronic devices require complete disassembly for maintenance or repair due to structural limitations, causing operational inconvenience.
Innovation Solution
A liquid cooled electronic device design featuring parallel guide rails for the computing and power supply units, allowing individual units to be easily removed and maintained without disassembling the entire device, along with adjustable panel arrangements for optimal cooling and protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the electronic device uses a conventional integrated structure for liquid cooling, then cooling efficiency is improved, but maintenance and repair operations become inconvenient requiring complete disassembly
Solution Approach 1:
The electronic device is divided into modular units (computing units and power supply units) that can be independently removed from the chassis via guide rails, allowing maintenance of specific components without complete disassembly while maintaining liquid cooling efficiency through preserved immersion structure
2Loss of energy
If the electronic device is completely immersed in cooling liquid for optimal cooling, then heat dissipation performance is improved, but operational complexity increases due to complete disassembly requirements
Solution Approach 1:
The device采用模块化设计，计算单元和电源单元通过导轨独立安装，支持部分拆卸维护，避免了完整拆装的操作复杂性，同时保持液冷浸没结构的冷却性能
Solution Approach 2:
通过导轨结构实现计算单元和电源单元的可提取式设计，使特定部件能够from the liquid cooling apparatus单独取出进行维护，而不需要将整个设备从液冷装置中移出
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates targeted maintenance and repair, reduces operational complexity, and optimizes cooling efficiency while minimizing liquid usage and costs.
Implementation Method 1
the cooling liquid circulates in the circulation loop to absorb heat from the electronic device and then release the heat at the cooling source apparatus
Implementation Method 2
the cooling liquid circulates in the circulation loop to absorb heat from the electronic device
Data Source
AI summary
The present application discloses a liquid cooled electronic device. The liquid cooled electronic device comprises a chassis unit. The chassis unit is circumferentially closed relative to a first direction. A first accommodating space extending in the first direction is formed within the chassis unit. A liquid cooled computing unit and a liquid cooled power supply unit that are electrically connected are arranged in the first accommodating space. The liquid cooled computing unit and the liquid cooled power supply unit are respectively inserted into the first accommodating space through a first guide rail and a second guide rail. The first guide rail and the second guide rail are arranged in parallel in the first direction. That is, the liquid cooled computing unit and the liquid cooled power supply unit are arranged in parallel via the parallel arrangement of the first guide rail and the second guide rail.