Liquid-Cooled Electronic Module with Conformal Heat Transfer Surface
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Solution Overview
Problem
Current cooling methods for electronic components, particularly in data processing centers, face inefficiencies due to high thermal resistance and energy consumption, especially when using air as a transfer medium, which limits server density and increases costs.
Innovation Solution
A sealable module with a housing and heat transfer device featuring a conduction surface that conforms to the electronic component, allowing for efficient heat transfer between a first cooling liquid and a second cooling liquid, reducing thermal resistance and eliminating the need for vapor-cycle refrigeration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If air is used as a transfer medium for heat, then the system can operate with simpler infrastructure, but the thermal resistance increases and heat transfer efficiency decreases
Solution Approach 1:
The patent introduces a liquid coolant as an intermediary transfer medium between the electronic components and the external environment. The liquid coolant absorbs heat from the components through conduction and convection, serving as a more efficient mediator than air for transferring large quantities of heat, thereby reducing thermal resistance while maintaining operational simplicity
Solution Approach 2:
The patent employs hydraulic cooling by circulating liquid coolant through channels in contact with electronic components. This hydraulic approach leverages the superior heat capacity and thermal conductivity of liquids compared to gases, enabling efficient heat removal without requiring complex infrastructure changes
2Temperature
If air conditioning is used to reduce local air temperature, then the temperature difference increases and heat transfer improves, but electrical power consumption increases substantially
Solution Approach 1:
The patent changes the physical state parameter of the cooling medium from gas (air) to liquid (coolant). This parameter change enables more efficient heat transfer at smaller temperature differences, reducing the need for high-power air conditioning systems while maintaining effective heat removal from electronic components
3Loss of energy
If air flow rate is increased to reduce thermal resistance, then heat transfer improves, but the system becomes more complex and energy-consuming
Solution Approach 1:
The patent replaces complex high-velocity air flow systems with simpler liquid coolant circulation. The liquid coolant's higher density and heat capacity allow for lower flow rates to achieve the same heat removal, simplifying the cooling system architecture while maintaining low thermal resistance
4Loss of energy
If servers are distributed sparsely to improve air flow, then thermal resistance decreases, but server density and space utilization decrease
Solution Approach 1:
The patent implements liquid cooling channels that can be integrated into compact server designs, allowing high server density without compromising heat removal efficiency. The liquid coolant directly contacts components through conformal surfaces, enabling effective cooling even in densely packed configurations where air flow would be restricted
5Temperature
If a condenser is used to provide refrigeration, then cooling is achieved, but system complexity and cost increase
Solution Approach 1:
The patent extracts and eliminates the condenser component from the cooling system by using liquid coolant circulation instead of vapor-compression refrigeration. The liquid coolant absorbs heat directly and can be dissipated through simpler heat exchange mechanisms, removing the complex phase-change equipment while maintaining effective cooling capability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances heat transfer efficiency, reduces energy consumption, and allows for increased server density by maintaining the cooling liquid in a liquid state, thereby improving cooling performance and reducing costs.
Implementation Method 1
the conduction surface separating the volume and the channel to allow conduction of heat between the volume and the channel through the conduction surface
Implementation Method 2
A coolant liquid, preferably oil, is pumped through the container. The processor board is located at the bottom of the container and an evaporator coil is positioned at the top of the container, such that convection currents are produced in the coolant liquid
Data Source
AI summary
A sealable module, cooled electronic system and method are described relating to cooling a heat generating electronic device. The sealable module is adapted to be filled with a first cooling liquid and a heat transfer device having a conduction surface defines a channel for receiving a second cooling liquid. In one embodiment, at least a portion of the conduction surface or housing is shaped in conformity with the shape of the electronic component. Control of the second cooling liquid is also described. Transferring heat between the second cooling liquid and a third cooling liquid features in embodiments. A method of filling a container with a cooling liquid is further detailed.