Liquid-Cooled Electronics Chassis with Barrier Leak Isolation

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Solution Overview

Problem

The increasing power density in computing devices necessitates efficient heat removal, as traditional air cooling methods are limited in efficiency and power consumption, leading to the need for liquid cooling modules, which require effective containment to prevent electronic components from direct liquid contact.

Innovation Solution

An electronics chassis is divided into an electronics region and a liquid isolation region by a liquid-tight barrier, with liquid cooling modules and conduits extending across the barrier to a separate liquid unit, ensuring any leaks remain contained and are detected promptly, while maintaining thermal contact with electronic components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If liquid cooling modules are used to cool high power density electronic devices, then cooling efficiency is improved, but the risk of liquid leakage damaging electronic components increases

Engineering Contradiction:

Improvecooling efficiencyVSAvoidliquid leakage risk

Core Design Contradiction:

TemperatureVSObject-affected harmful factors

Solution Approach 1:

The chassis is divided into two separate regions by a liquid-tight barrier: an electronics region containing electronic devices and a liquid isolation region containing the liquid cooling module and liquid unit. This segmentation physically separates components that should not contact liquid, allowing efficient liquid cooling while preventing liquid leakage from reaching electronic components.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

A liquid-tight barrier acts as an intermediary element between the electronics region and the liquid isolation region. The barrier includes sealed passageways that allow conduits to transfer cooling liquid while maintaining liquid-tight separation, thus enabling cooling functionality while preventing direct liquid contact with electronics.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If liquid cooling modules with permanently fixed conduits are used, then reliability is improved, but device complexity increases

Engineering Contradiction:

Improveconnection reliabilityVSAvoidmodule complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The module supply conduit and module return conduit are permanently fixed to the cooling block, merging these components into a single integrated assembly. This reduces the number of separate connections and potential failure points, improving reliability while the modular design keeps overall complexity manageable.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The conduits are permanently fixed to the cooling block during manufacturing, establishing reliable connections before the module is installed in the chassis. This preliminary action ensures that connection reliability is built into the design rather than relying on field assembly.

Inventive Principle:

Principle #10Preliminary action

3Reliability

If liquid unit is separated from electronic devices into a different region, then safety is improved, but conduit length and pressure loss increase

Engineering Contradiction:

Improvesystem safetyVSAvoidpressure loss

Core Design Contradiction:

ReliabilityVSLoss of energy

Solution Approach 1:

The liquid unit is positioned in a separate liquid isolation region that is spatially adjacent to the electronics region, separated only by a thin liquid-tight barrier. This dimensional arrangement allows short conduit paths through the barrier while maintaining physical separation for safety, minimizing pressure loss while preserving system safety.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enables effective liquid cooling without risking damage to electronic components, allowing for redundant cooling loops and easy maintenance of leaking connectors or conduits, thus ensuring reliable operation and safety.

Implementation Method 1

a cooling block in thermal contact with at least one of the electronic devices

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a liquid passageway from the module supply conduit through the cooling block to the module return conduit

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentUS12363871B2Electronics chassis with a barrier forming a liquid isolation region

Publication Date: 2025.07.15 LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE LTD

AI summary

An electronics chassis houses a plurality of electronic devices and a liquid cooling module that includes a cooling block for cooling at least one electronic device. Each liquid cooling module has a module supply conduit permanently fixed to the cooling block and a module return conduit permanently fixed to the cooling block to form a liquid passageway. A liquid unit is also disposed in the chassis and includes a liquid supply conduit and a liquid return conduit that are connected to the module supply conduit and the module return conduit of the liquid cooling module. In addition, a liquid-tight barrier is disposed in the electronics chassis to divide the electronics chassis into an electronics region containing the plurality of electronic devices and the liquid cooling module, and a liquid isolation region containing the liquid unit and allow of the connections between the liquid unit and the liquid cooling module.