Liquid-Cooled Flow Channel Plate for Uniform Heat Dissipation

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Solution Overview

Problem

Existing technologies fail to provide uniform heat dissipation and structural integrity in liquid-cooled flow channels of supercomputing devices, resulting in inconsistent performance and potential device failures due to thermal inefficiencies and structural weaknesses.

Innovation Solution

A liquid-cooled flow channel plate with a flow guide structure comprising a flow guide pillar and first flow guide plate, which guides medium flow uniformly across bends, ensuring consistent heat dissipation and structural support, while heat dissipation fins enhance thermal uniformity and anti-noise capabilities.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If liquid cooling flow channels are used to enhance heat dissipation efficiency, then heat dissipation performance is improved, but temperature uniformity across the width direction deteriorates due to significant variations in cooling effectiveness

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoidtemperature uniformity
Core Design Contradiction:
Loss of energyVSTemperature

Solution Approach 1:

The patent introduces flow guide structures (flow guide pillars and flow guide plates) at specific locations where flow velocity varies significantly. These local modifications redirect the cooling medium flow to ensure uniform velocity distribution across the width direction, thereby achieving uniform temperature distribution without compromising overall heat dissipation efficiency.

Inventive Principle:
Principle #3Local quality

2Temperature

If flow guide structures are added to improve flow velocity uniformity, then temperature consistency is improved, but device complexity increases

Engineering Contradiction:
Improvetemperature consistencyVSAvoidstructural complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The flow guide structure is segmented into multiple independent components: flow guide pillars positioned at junctions and flow guide plates arranged along the flow channels. This segmentation allows for modular manufacturing and assembly, reducing the complexity of fabricating a fully integrated flow guide system while still achieving uniform flow velocity distribution.

Inventive Principle:
Principle #1Segmentation

3Speed

If the flow guide pillar is positioned close to the separating strip to maximize flow guidance, then flow velocity uniformity is improved, but structural strength and anti-noise capability deteriorate

Engineering Contradiction:
Improveflow velocity uniformityVSAvoidstructural strength
Core Design Contradiction:
SpeedVSStrength

Solution Approach 1:

The flow guide pillar is preliminarily positioned at a optimized distance from the separating strip that balances flow guidance effectiveness with structural strength requirements. This preliminary positioning, combined with the support from the flow guide plate, ensures that the flow velocity is sufficiently uniform while maintaining adequate structural integrity and noise resistance.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution achieves uniform heat dissipation and structural integrity, improving performance and extending the lifespan of supercomputing devices by minimizing thermal inconsistencies and enhancing anti-noise capabilities.

Implementation Method 1

a plurality of sequentially communicated elongated slots that are juxtaposed are arranged in one surface of the base plate... each of the elongated slots, together with a corresponding portion of the cover plate, forms a medium flow channel

Methodology Applied
Scientific EffectConvection: Convection

Implementation Method 2

the hash chips being in contact with the outer surface... ensuring consistent heat dissipation

Methodology Applied
Scientific EffectHeat conduction: Conduction (thermal)

Data Source

PatentUS20250386453A1Liquid-cooled flow channel plate and supercomputing device
Publication Date: 2025.12.18 BITDEER SEMICONDUCTOR TECHNOLOGY PTE LTD
  • US20250386453A1 patent drawing
  • US20250386453A1 patent drawing
  • US20250386453A1 patent drawing

AI summary

Disclosed are a liquid-cooled flow channel plate and a supercomputing device. The liquid-cooled flow channel plate comprises a base plate and a cover plate. A plurality of sequentially communicated elongated slots that are juxtaposed are arranged in one surface of the base plate. A separating strip is formed between two adjacent elongated slots of the elongated slots. A free end of the separating strip is disposed at a junction between the two adjacent elongated slots. A flow guide structure is arranged at the junction, wherein the flow guide structure includes a flow guide pillar and a first flow guide plate. The flow guide pillar is disposed in an extension direction of the separating strip and is spaced apart from both the separating strip and a slot wall of the elongated slot where the flow guide pillar is disposed.