Liquid-Cooled Semiconductor Layout With Flow-Disrupting Connector
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Solution Overview
Problem
Existing liquid-cooled electronic components face challenges in effectively dissipating heat from semiconductor components while preventing overheating and ensuring electrical connectivity, with conventional methods failing to optimize coolant flow for enhanced heat transfer.
Innovation Solution
A liquid-cooled electronic component design featuring a connecting element with a flow disruptor element that intersects the coolant flow direction, enhancing both the guidance and turbulence of the coolant flow to improve heat transfer between semiconductor components and the coolant, while maintaining electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional connecting element is used to electrically connect semiconductor component sections, then electrical connectivity is maintained, but heat dissipation efficiency is insufficient
Solution Approach 1:
The patent merges the electrical connection function and the flow control function into a single connecting element. The connecting element not only electrically connects the semiconductor component sections but also incorporates a flow disruptor element that actively controls coolant flow, thereby achieving both electrical connectivity and improved heat dissipation through one integrated component.
Solution Approach 2:
The connecting element is designed to perform multiple functions simultaneously: it provides electrical connectivity between semiconductor sections and acts as a flow disruptor to enhance coolant turbulence and heat transfer. This multi-functional design resolves the contradiction by making the same component serve both electrical and thermal management purposes.
2Temperature
If coolant flow is increased to improve heat transfer, then heat dissipation efficiency improves, but flow uniformity and cooling stability deteriorate
Solution Approach 1:
The flow disruptor element is strategically positioned at specific locations where flow uniformity needs improvement. Rather than uniformly disrupting flow throughout the entire coolant path, the flow disruptor creates localized turbulence in specific regions, enhancing heat transfer where needed while preserving overall flow stability and uniformity in other areas.
Solution Approach 2:
The flow disruptor element mechanically disturbs the coolant flow to create controlled turbulence. This mechanical disruption enhances mixing and heat transfer efficiency by breaking up laminar flow patterns and creating eddies that improve thermal contact between the coolant and semiconductor surfaces, while the disruptor's fixed position ensures the turbulence remains controlled and stable.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves improved heat dissipation and cooling efficiency by directing and increasing turbulence of the coolant flow, leading to enhanced heat transfer and reduced overheating risks.
Implementation Method 1
the turbulence of the coolant flow is increased, at least locally, in the area of the flow disruptor element
Implementation Method 2
Both effects—the targeted guidance of the coolant flow and the modification of the local turbulence of the coolant flow—improve heat transfer from the two semiconductor component sections to the coolant
Implementation Method 3
the coolant is dielectric to prevent a short circuit
Implementation Method 4
the coolant is ultimately deflected or guided in a predetermined direction by means of the flow disruptor element, so that the flow disruptor element acts as a flow guide element
Data Source
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AI summary
The invention relates to a liquid-cooled electronic component (10). The component (10) comprises: a substrate (12); a first semiconductor component portion (14) mounted on the substrate (12); a second semiconductor component portion (16) that is mounted on the substrate (12) and is spaced apart from the first semiconductor component portion (14); a cooling liquid supply means for supplying cooling liquid to the first semiconductor component portion (14) and the second semiconductor component portion (16), wherein the cooling liquid supply means predefines a main flow direction (22) of the cooling liquid; a connecting element (18, 30-34) that electrically connects the first semiconductor component portion (14) and the second semiconductor component portion (16) to one another; and a flow disruption element (24) that is formed on the connecting element (18, 30-34) and extends from the connecting element (18, 30-34) such that the flow disruption element (24) crosses the main flow direction (22) of the cooling liquid.