Liquid-Cooled Gate Driver Layout for High-Frequency SiC Modules
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Solution Overview
Problem
Conventional cooling methods for gate driver circuits in power electronics, relying on convection, are insufficient at high switching frequencies, limiting the utilization of SiC power semiconductors and reducing the efficiency and performance of drive inverters, especially in vehicles.
Innovation Solution
An active cooling system is integrated with silicon carbide semiconductor modules and driver circuits, using a cooling module that connects the driver circuit and semiconductor module thermally and mechanically, allowing for forced convection with a cooling medium like water, and utilizing thermal interface materials for enhanced heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional cooling by free convection in air is used for driver circuits, then the structure is simple and easy to manufacture, but the cooling efficiency is insufficient at switching frequencies >20 kHz, limiting the utilization of SiC power semiconductors
Solution Approach 1:
The patent applies hydraulic cooling by introducing a liquid cooling circuit with cooling channels directly into the driver circuit substrate. This allows forced convection cooling through circulating coolant, enabling high switching frequencies >20 kHz while maintaining compact integration. The cooling channels are embedded within the substrate structure, providing efficient heat removal without requiring separate external cooling components.
Solution Approach 2:
The patent merges the cooling function directly into the driver circuit substrate by integrating cooling channels within the same structural layer. This combines the electrical circuit functions and thermal management functions into a single integrated component, eliminating the need for separate cooling assemblies and enabling high-frequency operation while maintaining manufacturing simplicity.
2Area of stationary object
If cooling plates are attached to driver ICs to improve convection cooling, then the cooling surface is increased, but the cooling efficiency remains far from sufficient at switching frequencies >20 kHz
Solution Approach 1:
The patent replaces passive convection cooling with active hydraulic cooling by embedding liquid cooling channels within the driver circuit substrate. This allows forced convection through circulating coolant, providing superior heat removal efficiency that enables switching frequencies >20 kHz, overcoming the limitations of increased surface area alone.
Solution Approach 2:
The patent introduces a liquid coolant as an intermediary heat transfer medium between the driver circuit components and the external cooling system. The coolant circulates through embedded channels, efficiently carrying heat away from the high-frequency switching components, enabling operation at >20 kHz that cannot be achieved with air convection alone.
3Loss of energy
If the switching frequency of the drive converter is limited to minimize power loss of the gate driver circuit, then the power loss is reduced, but the efficiency and performance of the entire drive inverter are lost
Solution Approach 1:
The patent uses liquid cooling with forced convection to efficiently remove heat from the gate driver circuit, enabling operation at high switching frequencies without excessive power loss. The hydraulic cooling system maintains driver circuit temperatures within acceptable ranges even at >20 kHz, allowing the system to achieve both low power loss and high efficiency simultaneously.
Solution Approach 2:
The patent changes the thermal management parameters by transitioning from air convection to liquid cooling, which fundamentally alters the heat removal capability. This parameter change enables the system to operate at higher switching frequencies with acceptable power loss, simultaneously improving both efficiency and performance of the drive inverter.
4Productivity
If SiC power semiconductors are used to increase switching frequency, then the efficiency and performance improve, but the gate driver circuit overheats and cannot operate without temperature restrictions
Solution Approach 1:
The patent implements liquid cooling with forced convection through embedded channels in the driver circuit substrate. This hydraulic cooling system efficiently removes heat generated by high-frequency SiC power semiconductor operation, enabling switching frequencies >20 kHz without temperature restrictions that would otherwise limit operation.
Solution Approach 2:
The patent merges the thermal management function directly into the driver circuit substrate by integrating cooling channels within the same structural layer. This integrated approach efficiently handles the heat generated by SiC power semiconductors at high switching frequencies, eliminating temperature restrictions while maintaining compact design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables the gate driver circuit to operate without temperature restrictions, reducing costs and increasing robustness, allowing higher switching frequencies and better utilization of SiC semiconductors, thereby enhancing the efficiency and performance of power electronics in vehicles.
Implementation Method 1
the at least one cooling module of the cooling system is designed to accommodate and/or transport or convey a cooling medium, typically a cooling liquid, and to actively cool the driver circuit and possibly the at least one semiconductor module
Implementation Method 2
a thermal interface made of thermally conductive material can be arranged between the driver circuit, the at least one fastening module, and the at least one cooling module
Data Source
AI summary
An arrangement which has at least one semiconductor module made of silicon carbide, a driver circuit for the at least one semiconductor module, and a cooling system, wherein the at least one semiconductor module and the driver circuit are arranged adjacent to one another, wherein the driver circuit is connected to the cooling system.