Liquid-Cooled Heat Pipe Assembly for Uniform Multi-Element Cooling
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Solution Overview
Problem
Existing air-cooling methods for heating elements are inefficient and struggle to adapt to limited spaces, leading to poor cooling effects.
Innovation Solution
A heat dissipation device utilizing a liquid-cooling plate and heat pipes arranged in assemblies, where each heat pipe is configured to contact both heating elements and a liquid-cooling flow channel, allowing heat transfer to a coolant, with adjustable length and width to control temperature differences between heating units.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If air-cooling method is used for heating elements, then the device structure is simple, but the cooling effect is poor
Solution Approach 1:
Heat pipes are introduced as intermediary components between the heating elements and the liquid-cooling plate. The heat pipes conduct heat from the heating elements to the liquid-cooling plate through thermal conduction, effectively transferring heat away from the heating elements to achieve better cooling效果
Solution Approach 2:
The patent transitions from air-cooling to liquid-cooling by introducing a liquid-cooling plate with flow channels through which coolant flows. The coolant absorbs heat from the heating elements via the heat pipes and carries it away, providing superior cooling performance compared to air-cooling
2Volume of stationary object
If air-cooling structure is applied, then the device occupies less space, but it is difficult to adapt to limited space of the box
Solution Approach 1:
The heat pipes are embedded within the liquid-cooling plate, with portions of the heat pipes extending into the flow channels. This nested arrangement allows the heat dissipation functionality to be integrated within the plate structure itself, maximizing space utilization while maintaining effective heat transfer
Solution Approach 2:
The patent transitions from two-dimensional air cooling to three-dimensional liquid cooling by introducing vertical heat transfer paths through the heat pipes that extend from the heating elements into the liquid-cooling plate's flow channels, enabling more efficient heat removal in limited space
3Stability of the object's composition
If heat pipes with configurable length and width are used, then temperature uniformity among heating units is improved, but the device complexity increases
Solution Approach 1:
Different heat pipes are configured with different lengths and/or widths according to their specific positions and heat dissipation requirements. Heat pipes contacting heating units with higher temperatures or greater heat generation are designed with larger dimensions to enhance heat transfer capacity, while those in cooler regions have smaller dimensions, optimizing overall temperature uniformity
Solution Approach 2:
The patent varies the physical parameters (length and width) of the heat pipes to optimize heat transfer performance. By adjusting these parameters, the heat transfer capacity of each heat pipe is tailored to match the local heat generation characteristics of the heating units it contacts, achieving more uniform temperature distribution across all heating elements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device achieves effective heat dissipation with improved cooling efficiency without occupying excessive space, ensuring uniform temperature distribution among heating units.
Implementation Method 1
at least a portion of each heat pipe of the plurality of heat pipes is in thermal contact with the liquid-cooling flow channel and configured to transfer heat generated by the plurality of heating elements to the liquid-cooling flow channel
Implementation Method 2
heat generated by the heating element is transferred from the heat pipe to a coolant inside the liquid-cooling flow channel and is taken out of the liquid-cooling plate with the flow of the coolant
Data Source
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AI summary
A heat dissipation device is provided. The heat dissipation device is configured to dissipate heat from a plurality of heating elements, each heating element of the plurality of heating elements includes a respective plurality of heating units, the heat dissipation device includes: a liquid-cooling plate and a plurality of heat pipes arranged in a plurality of heat pipe assemblies, and each heat pipe assembly of the plurality of heat pipe assemblies includes at least one respective heat pipe. A respective heat pipe assembly of the plurality of heat pipe assemblies is configured to be in contact with at least one corresponding heating element of the plurality of heating elements. Each heat pipe of the respective heat pipe assembly is configured to be in contact with at least one heating unit of the at least one corresponding heating element.