Liquid-Cooled Heat Sink with Heat Pipes for Compact High Heat Loads
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Solution Overview
Problem
Existing cooling methods for electronic devices, such as air cooling and cold plates, are inefficient and complex, and as technology advances, the increasing heat generated by smaller components necessitates a more effective heat transfer solution.
Innovation Solution
A heat sink design incorporating heat pipes and/or vapour chambers within an internal volume that receives coolant, allowing for efficient heat transfer and a high thermal capacity, with features like modular housing, baffles, and optimized coolant flow patterns to maximize heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If air cooling with fins and fans is used, then the cooling system is simple in structure, but the cooling efficiency is low and energy consumption is high
Solution Approach 1:
The patent replaces air cooling with liquid coolant circulation through heat pipes and vapour chambers. The coolant absorbs heat from electronic components and transports it to heat dissipation regions, achieving superior cooling efficiency with reduced energy consumption compared to fan-driven air cooling systems
Solution Approach 2:
The patent utilizes phase change mechanisms in heat pipes and vapour chambers where working fluid evaporates at the heating end to absorb heat and condenses at the cooling end to release heat. This phase transition process enables highly efficient heat transfer without requiring additional energy input for pumping
2Loss of energy
If heat pipe density is increased to improve heat transfer, then thermal capacity increases, but device complexity increases
Solution Approach 1:
The patent combines multiple heat pipes and vapour chambers into an integrated cooling assembly that functions as a unified thermal management system. This merging approach achieves high heat transfer capacity through coordinated operation of multiple components while reducing overall system complexity compared to managing individual heat pipes separately
Solution Approach 2:
The heat pipes and vapour chambers serve multiple functions simultaneously: heat conduction from hot spots, heat distribution across the cooling surface, and passive heat pumping without external power. This multi-functionality reduces the need for additional components, maintaining simplicity while achieving high thermal capacity
3Loss of energy
If coolant flow path is optimized for heat dissipation, then thermal performance improves, but manufacturing complexity increases
Solution Approach 1:
The cooling system is segmented into distinct functional zones: heat absorption regions with heat pipes, coolant circulation channels, and heat dissipation areas. This segmentation allows each zone to be optimized independently for its specific function while simplifying the overall manufacturing process through modular construction
Solution Approach 2:
The patent employs nested structures where heat pipes are positioned within or adjacent to coolant flow channels, and multiple cooling layers are stacked vertically. This nesting arrangement maximizes heat transfer surface area within compact volumes while maintaining straightforward manufacturing sequences
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves superior thermal performance by maximizing heat pipe density and coolant contact area, effectively dissipating heat from high-power devices, even in compact designs.
Implementation Method 1
A heat sink is provided having heat pipes and/or vapour chambers within an internal volume that also receives a coolant fluid
Implementation Method 2
The heat pipes and/or vapour chambers, which are normally elongated, carry heat from the base to an upper portion of the internal volume
Implementation Method 3
The heat pipes and/or vapour chambers advantageously extend from a heat transfer surface or block at a base of the heat sink. The heat pipes and/or vapour chambers, which are normally elongated, carry heat from the base to an upper portion of the internal volume
Implementation Method 4
The coolant is normally provided from outside the heat sink and after passing through the internal volume, leaves the internal volume
Data Source
AI summary
A heat sink for cooling a heat generating device comprises: a housing, comprising: a heat transfer block for receiving heat from the heat generating device; and side walls, extending from the heat transfer block, the heat transfer block and side walls together defining an internal volume for receiving a coolant from external the heat sink; and a plurality of heat pipes and/or vapour chambers, each heat pipe and/or vapour chamber extending from the heat transfer block within the internal volume. A cooled electronic system comprises: an electronic device that generates heat in use, heat being dissipated from the electronic device through an external surface of the electronic device; and the heat sink, having the heat transfer block mounted on the external surface of the electronic device.