Liquid Cooled IT Room Architecture Design Tool

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Current IT room cooling systems face challenges in optimizing the design of liquid-cooled architectures due to the separate optimization of server hardware and room-level cooling systems, leading to inefficient cooling performance and increased complexity in managing heat transfer between immersion-cooled and air-cooled equipment.

Innovation Solution

A graphical user interface-based system that allows for real-time thermal analysis and optimization of liquid-cooled IT room architectures by simultaneously displaying configuration and results regions, enabling users to input design parameters and visualize the impact on cooling power and surface temperatures through energy balance and heat exchange equations, utilizing precomputed constants from CFD simulations to calculate thermal resistances and heat transfer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If separate optimization is used for server hardware cooling and room-level cooling systems, then design complexity is reduced, but cooling performance optimization is insufficient and thermal coupling between immersion-cooled and air-cooled equipment cannot be managed effectively

Engineering Contradiction:
Improvedesign complexityVSAvoidcooling performance optimization
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The patent merges the server hardware cooling design and room-level cooling system design into a unified thermal management framework. The system simultaneously optimizes both immersion-cooled server racks and air-cooled room environment by establishing thermal coupling models that capture heat transfer interactions between the two systems, allowing coordinated optimization rather than separate design approaches

Inventive Principle:
Principle #5Merging (Combining)

2Measurement precision

If extensive computational fluid dynamics simulations are performed for thermal analysis, then measurement precision is improved, but loss of time and computational resources increases

Engineering Contradiction:
Improvethermal analysis precisionVSAvoidcomputational time
Core Design Contradiction:
Measurement precisionVSLoss of time

Solution Approach 1:

The patent performs preliminary computational fluid dynamics simulations to pre-compute thermal resistances and heat transfer coefficients for various rack configurations and environmental conditions. These pre-computed values are stored in lookup tables, allowing the design tool to quickly query and apply pre-determined thermal parameters without performing full CFD simulations during the design phase, thus achieving high precision with minimal computational time

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent creates simplified thermal resistance models that replicate the complex CFD simulation results in a computationally efficient form. By copying the essential thermal behavior from detailed CFD simulations into reduced-order models with pre-computed constants, the system maintains measurement precision while dramatically reducing the computational resources and time required for design iterations

Inventive Principle:
Principle #26Copying

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Facilitates the design of efficient liquid-cooled IT room architectures by providing a visual and interactive tool for optimizing cooling performance, reducing the need for extensive computational fluid dynamics simulations and allowing for real-time adjustments to improve cooling efficiency and reduce cooling redundancy.

Implementation Method 1

determining a dielectric fluid return temperature based on an energy balance equation and a heat exchange equation

Methodology Applied
Scientific EffectHeat exchange: Conduction (thermal)

Implementation Method 2

calculating an overall thermal resistance between the ambient environment and external skin of the at least one immersion-cooled equipment rack

Methodology Applied
Scientific EffectThermal resistance: Conduction (thermal)

Implementation Method 3

determining a dielectric fluid return temperature based on an energy balance equation and a heat exchange equation

Methodology Applied
Scientific EffectEnergy balance:

Implementation Method 4

visualize the impact on cooling power and surface temperatures through energy balance and heat exchange equations

Methodology Applied
Scientific EffectHeat transfer: Conduction (thermal)

Data Source

PatentUS20220137805A1Systems and methods for determining liquid cooled architectures in an it room
Publication Date: 2022.05.05 SCHNEIDER ELECTRIC IT CORP
  • US20220137805A1 patent drawing
  • US20220137805A1 patent drawing
  • US20220137805A1 patent drawing

AI summary

Methods and systems for designing a liquid cooled IT room architecture for an IT room include receiving a design parameter, responsive to a user input, corresponding to at least one equipment rack in the IT room, determining a dielectric fluid return temperature Thin in the architecture based on an energy balance equation and a heat exchange equation, and responsive to receiving the design parameter and determining the dielectric fluid return temperature, dynamically calculating and displaying at least one of a surface temperature of at least one immersion-cooled equipment rack cooled by the architecture or an amount of required room cooling power per a unit of area of the IT room.