Liquid Cooled Multi-Module Test Head for High Density Signal Integrity
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Solution Overview
Problem
The increasing density and performance of integrated circuits require automatic test equipment to handle higher communication pathways and power densities, leading to challenges with signal fidelity and cooling, particularly due to the limitations of natural convection and the physical constraints of coaxial cables.
Innovation Solution
The implementation of a channel board-to-DIB junction multi-module with performance-critical electronics modules and a coolant distribution apparatus for immersion cooling, along with a cable-less connection system to reduce signal degradation and enhance cooling efficiency, allowing for direct proximity of test circuits to the device-under-test.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If natural convection cooling is used, then the system is simple and low cost, but the cooling capacity is insufficient for high power densities
Solution Approach 1:
The patent implements liquid cooling systems with coolant flow channels integrated into the test head structure, replacing natural convection cooling to achieve sufficient cooling capacity for high power density circuits while maintaining system compactness
Solution Approach 2:
The cooling channels are merged with the structural components of the test head, combining thermal management functionality with mechanical support structures to avoid adding separate complex cooling systems
2Reliability
If coaxial cables are used for signal transmission, then signal fidelity is maintained, but the system becomes physically large and heavy
Solution Approach 1:
The patent extracts and eliminates the coaxial cable infrastructure from the test system by implementing direct board-to-board connections, removing the harmful element (excessive cable mass) while maintaining signal transmission functionality through alternative pathways
Solution Approach 2:
The patent transitions from three-dimensional cable routing to two-dimensional planar signal transmission pathways on circuit boards, reducing the physical space and weight requirements while maintaining signal integrity through controlled impedance designs
3Productivity
If more channels are added to test higher density circuits, then testing capability increases, but the number of coaxial cables increases causing routing problems
Solution Approach 1:
The patent segments the test system into modular functional blocks with integrated connections, allowing multiple test channels to be added without proportionally increasing cable complexity by using shared infrastructure and parallel signal paths on circuit boards
Solution Approach 2:
The patent implements universal circuit board interfaces and standardized connection protocols that allow multiple channels to share common routing pathways, reducing the need for individual dedicated cables for each channel and simplifying overall system architecture
4Device complexity
If test circuits are packaged in the main electronic test control circuits, then integration is achieved, but signal transmission distance becomes too long causing degradation
Solution Approach 1:
The patent inverts the traditional architecture by placing test circuitry at the edge of the device interface board closest to the device under test, rather than in the main control electronics, thereby minimizing signal transmission distance and improving signal fidelity while maintaining integration
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables high-performance testing at high densities and clock speeds with improved signal fidelity and cooling, reducing the need for extensive coaxial cables and addressing the limitations of current cooling methods.
Implementation Method 1
a coolant distribution apparatus to provide cooling within the enclosure
Implementation Method 2
the cooling demands have increased over time from natural convection in the 1970's to indirect liquid cooling
Data Source
Figure 1A
Figure 1B
Figure 2
AI summary
In one embodiment, a channel board-to-DIB junction multi-module is provided which includes performance critical channel electronics modules within an enclosure encasing the plurality of performance critical channel electronics modules. A coolant distribution apparatus is provided within the enclosure to provide cooling within the enclosure. A channel board connection apparatus is located at a channel board end of the channel board-to-DIB junction multi- module and a cable-less connection apparatus is located at a DIB end of the channel board-to-DIB junction multi-module.