Liquid-Cooled Optical Window Assembly for Uniform Wafer Heating
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Solution Overview
Problem
Conventional semiconductor processing apparatuses face challenges in rapidly and uniformly controlling substrate temperature due to issues with thermal feedback loops and temperature gradients caused by infrared radiation from quartz windows, leading to non-uniform heating and potential damage to illumination devices.
Innovation Solution
Employing sapphire, AlON, or Spinel windows with integrated liquid cooling systems to mitigate thermal feedback and gradients, using materials that are transparent to visible and infrared light and coupled with cooling plates to manage heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If quartz windows are used in conventional semiconductor processing apparatuses, then the windows are transparent to infrared radiation allowing heating, but thermal feedback loops and temperature gradients occur causing non-uniform heating
Solution Approach 1:
The patent introduces a cooling plate as an intermediary component between the illumination devices and the substrate. This cooling plate actively manages thermal feedback by providing a controlled thermal interface, preventing the thermal runaway effects that occur with conventional quartz windows alone. The cooling plate serves as a mediator that decouples the infrared heating function from the uncontrolled thermal feedback problem.
Solution Approach 2:
The patent changes the thermal parameters of the window system by using sapphire, AlON, or Spinel materials with different thermal conductivity and emissivity characteristics compared to conventional quartz. These material parameter changes, combined with active cooling, fundamentally alter the thermal feedback loop characteristics to achieve uniform heating without the temperature gradients that plague conventional systems.
2Productivity
If rapid heating and cooling is achieved using light-based heating systems, then processing throughput increases, but thermal gradients cause non-uniform heating and potential damage to illumination devices
Solution Approach 1:
The patent segments the thermal management function by separating the heating function (illumination devices) from the thermal control function (cooling plate with cooling passages). This segmentation allows the illumination devices to operate at high power for rapid heating while the cooling plate independently manages thermal gradients and protects the illumination devices from thermal damage through active cooling channels.
Solution Approach 2:
The cooling plate acts as a thermal intermediary that protects the illumination devices from the harmful thermal effects. It absorbs and redistributes excess heat through its cooling passages, preventing thermal damage to the illumination devices while maintaining the rapid heating capability needed for high productivity.
3Use of energy by moving object
If conventional quartz windows are used, then infrared radiation transmission is achieved, but thermal feedback loops cause temperature gradients
Solution Approach 1:
The patent employs composite material structures - specifically sapphire, AlON, or Spinel windows combined with actively cooled plate structures. These composite systems maintain infrared transmission capability while the active cooling component suppresses thermal feedback loops and temperature gradients, achieving both energy transmission and temperature uniformity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Achieves uniform and efficient heating of substrates by minimizing thermal gradients and reducing damage to illumination devices, enhancing processing uniformity and throughput.
Implementation Method 1
using materials that are transparent to visible and infrared light
Implementation Method 2
caused by infrared radiation from quartz windows
Implementation Method 3
coupled with cooling plates to manage heat dissipation
Implementation Method 4
integrated liquid cooling systems
Implementation Method 5
allowing for rapid heating and cooling of the wafers using, for example, radiative heating using visible light
Data Source
AI summary
Window/cooling plate assemblies for use with illumination-based radiative heating systems for semiconductor wafer processing tools are provided. Such assemblies may have a window and a cooling plate that are placed adjacent each other; one or more cooling passages may be located within one or both of the window and the cooling plate. The window and cooling plate may be optically transparent to at least some visible light and the window additionally optically transparent to at least some infrared light.