Liquid-Cooled Package Assembly for Electronic Component Heat Dissipation
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Solution Overview
Problem
Existing electronic component packages struggle with inefficient heat dissipation, leading to potential damage and performance degradation due to accumulated heat.
Innovation Solution
A package assembly design that includes a substrate, an electronic component, a cover with a heat dissipation space, and tubes for cooling liquid flow, along with a thermal interface material to enhance heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional packaging structures are used for electronic components, then the device complexity is low, but heat dissipation efficiency is poor leading to accumulated heat
Solution Approach 1:
The packaging structure is segmented into multiple functional zones: a chamber for the electronic component, a heat dissipation space surrounded by insulation layers, and thermal interface material layers. This segmentation allows heat to be managed in different zones - generated heat is conducted through thermal interface material to the cover, while the insulation layers prevent heat from reaching the chamber, effectively isolating heat dissipation from the component area.
Solution Approach 2:
Thermal interface material is introduced as an intermediary substance between the electronic component and the cover. This material has high thermal conductivity and facilitates efficient heat transfer from the component to the cover's heat dissipation structure, overcoming the thermal resistance that would otherwise accumulate at the component-cover interface.
2Temperature
If heat dissipation structures are added to improve cooling, then heat dissipation efficiency improves, but the device complexity increases
Solution Approach 1:
The cover serves dual functions: it protects the electronic component and simultaneously acts as a heat dissipation structure. The insulation layers are integrated into the cover structure, forming a unified component that combines thermal management functions with the protective enclosure, reducing the need for separate cooling devices.
Solution Approach 2:
The cover is designed with multi-functionality: it provides mechanical protection for the electronic component, serves as a thermal conduction path for heat dissipation, and acts as a barrier through integrated insulation layers. This universal design eliminates the need for additional dedicated cooling components, maintaining simplicity while achieving effective heat management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively reduces thermal resistance and improves heat dissipating efficiency, as demonstrated by simulation analysis showing a significant reduction in thermal resistance and enhanced cooling performance.
Implementation Method 1
a first thermal interface material is disposed in the chamber and sandwiched in between the electronic component and the top portion
Implementation Method 2
The first tube is connected to the first side portion and communicates with the heat dissipation space. The second tube is connected to the second side portion and communicates with the heat dissipation space
Data Source
AI summary
A package assembly includes a substrate, an electronic component and a cover. The electronic component and the cover are disposed on the substrate, wherein the electronic component is located within a chamber between the cover and the substrate. A cooling liquid may be filled in a heat dissipation space of the cover, so as to dissipate the heat generated by the electronic component. Furthermore, the cooling liquid may be filled in the chamber where the electronic component is located, so as to directly dissipate the heat generated by the electronic component.