Liquid-Cooled Semiconductor Package Structure for Chip Heat Dissipation
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Solution Overview
Problem
Conventional semiconductor packages suffer from weak heat dissipation, making them vulnerable to heat concentration during the fabrication process, which can lead to malfunctions and damage.
Innovation Solution
A semiconductor package design that includes a substrate layer, a chip, a housing lid, and thermal-conductive liquid, with features such as through silicon vias (TSVs), microchannels, and a metal mesh to enhance heat dissipation, using thermal-conductive liquids like CFC and incorporating an adhesive layer and solder bumps for electrical coupling, along with a housing lid with holes and plugs for controlling liquid flow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional semiconductor package structure is used, then manufacturing is simple, but heat dissipation capability is weak
Solution Approach 1:
The semiconductor package is divided into multiple functional layers including substrate layer, housing lid, adhesive layer, and thermal conduction layer. Each layer performs specific heat dissipation functions, allowing the complex thermal management task to be broken down into manageable segments that can be manufactured and assembled separately.
Solution Approach 2:
A thermal conduction layer is introduced as an intermediary between the chip and the housing lid/substrate. This intermediate layer specifically addresses heat transfer from the chip, mediating the thermal path and improving overall heat dissipation without requiring complete redesign of the entire package structure.
2Reliability
If conventional semiconductor package is used, then structure is simple, but heat concentration causes damage during fabrication
Solution Approach 1:
The thermal conduction layer and heat dissipation structures are built into the package design before the chip is subjected to high-temperature fabrication processes. This pre-established thermal pathway provides cushioning protection against heat concentration during manufacturing, preventing damage before it occurs.
Solution Approach 2:
The housing lid and substrate are configured to work together with the thermal conduction layer to convert the potentially harmful concentrated heat into beneficial heat dissipation. The structure transforms the heat problem into an opportunity for enhanced thermal management through controlled heat flow paths.
3Temperature
If thermal conduction layer is added to improve heat dissipation, then thermal management improves, but manufacturing process becomes more complex
Solution Approach 1:
The thermal conduction layer utilizes materials with optimized thermal conductivity parameters. By selecting materials and configurations that maximize heat transfer efficiency, the layer achieves effective thermal management while maintaining compatibility with existing manufacturing processes, reducing the impact of added complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively dissipates heat, preventing damage from heat concentration and improving the semiconductor package's thermal management capabilities, allowing for stable electronic operations and efficient heat removal.
Implementation Method 1
the thermal-conductive liquid is filled within the internal space
Implementation Method 2
an adhesive layer that is disposed between the housing lid and the substrate layer. In addition, the adhesive layer substantially contacts both the housing lid and the substrate layer for adhering the housing lid with the substrate layer
Data Source
AI summary
A semiconductor package is disclosed for efficiently facilitating heat dissipation. The semiconductor package includes a substrate layer, a chip, a housing lid and thermal-conductive liquid. A chip is disposed on the substrate layer and electrically coupled to the substrate layer. The chip includes at least one through silicon via (TSV). The housing lid is disposed above both the substrate layer and the chip. Also, the housing lid is coupled to the substrate layer at its edge for forming an internal space that encompasses the chip. The thermal-conductive liquid is filled within the internal space.