Liquid-Cooled Package Substrate With Integrated Cooling Chamber

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Solution Overview

Problem

Existing embedded package substrate designs struggle with high heat dissipation requirements for high-frequency, high-speed, and high-power electronic components, particularly due to limitations in heat dissipation performance and complex, costly processing flows.

Innovation Solution

A liquid circulating cooling package substrate with a circulating cooling structure integrated into the heat dissipation face, featuring a metal heat dissipation layer, a cooling chamber, and a support column connected to a cooling cover with liquid inlets and outlets, allowing for efficient heat dissipation through external cooling liquid circulation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a metal frame is used to embed components and a cavity is pre-processed on a metal plate, then heat dissipation performance is improved, but the process flow becomes complex and costly

Engineering Contradiction:

Improveheat dissipation performanceVSAvoidprocess flow complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent merges the support frame and cooling structure into a single integrated component. The support frame directly incorporates the cooling cavity and heat dissipation structures, eliminating the need for separate metal frame processing and assembly steps. This integration maintains effective heat dissipation while significantly simplifying the manufacturing process flow.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The support frame is designed to serve multiple functions simultaneously: it provides mechanical support for embedding components, forms the cooling cavity for liquid circulation, and acts as a heat dissipation structure. This multi-functionality reduces the number of separate components and processing steps required, addressing the complexity issue while maintaining heat dissipation performance.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Temperature

If a metal frame is used to embed components, then heat dissipation performance is improved, but the manufacturing cost increases

Engineering Contradiction:

Improveheat dissipation performanceVSAvoidmanufacturing cost

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

By combining the support frame and cooling structure into one integrated component, the patent reduces the number of parts that need to be manufactured, processed, and assembled. This integration lowers manufacturing costs through reduced material waste, fewer processing steps, and simplified assembly operations, while still achieving effective heat dissipation.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent optimizes the structural parameters of the support frame to achieve efficient heat dissipation with simpler manufacturing. By carefully designing the thickness, shape, and configuration of the cooling cavity and heat dissipation features, the patent maintains thermal performance while using more manufacturable geometries that reduce processing complexity and cost.

Inventive Principle:

Principle #35Parameter changes

3Ease of manufacture

If organic polymer materials are used for the frame, then ease of manufacture is improved, but heat dissipation performance becomes insufficient

Engineering Contradiction:

Improveease of manufactureVSAvoidheat dissipation performance

Core Design Contradiction:

Ease of manufactureVSTemperature

Solution Approach 1:

The patent employs a composite structure where the support frame is made of metal material (providing heat dissipation) while integrating cooling cavities and dielectric layers (providing manufacturing ease and electrical insulation). This composite approach combines the thermal advantages of metal with the manufacturing advantages of polymer-based processes, achieving both heat dissipation performance and ease of manufacture.

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides rapid heat dissipation, improves reliability, and reduces substrate thickness by utilizing substrate space efficiently, while maintaining a simple and cost-effective manufacturing process.

Implementation Method 1

a circulating cooling structure, including a cooling chamber formed in the first dielectric layer to expose the heat dissipation face

Methodology Applied

Scientific EffectConvection: Convection

Implementation Method 2

a metal heat dissipation layer formed on the inner surface of the cooling chamber

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS12598991B2Liquid circulating cooling package substrate and manufacturing method thereof

Publication Date: 2026.04.07 ZHUHAI ACCESS SEMICONDUCTOR CO LTD

AI summary

A liquid circulating cooling package substrate includes a circulating cooling structure including a cooling chamber in a first dielectric layer to expose a heat dissipation face, a metal heat dissipation layer on the inner surface of the cooling chamber, an upright support column formed on a metal heat dissipation layer, and a cooling cover supported on the support column to close the cooling chamber along the periphery of the cooling chamber. The metal heat dissipation layer completely covers the heat dissipation face and the inner side surface of the cooling chamber, and a liquid inlet and a liquid outlet are formed on the cooling cover. A circulating cooling structure is provided in the first dielectric layer, and the circulating cooling structure is formed during the processing of an embedded package substrate such that the processing flow is simple and the cost is low.