Liquid-Cooled Heat Dissipation Panels for Hinge-Crossing Devices

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Solution Overview

Problem

Existing heat dissipation systems in electronic devices, particularly portable devices, are limited by the inability of passive heat dissipation elements like heat pipes to cross hinges, leading to uneven heat distribution and insufficient dissipation, especially in devices with high power consumption.

Innovation Solution

A heat dissipation system utilizing rotating shaft assemblies and liquid channels between two heat dissipation panels, driven by a pumping mechanism to circulate a liquid medium, expanding the heat dissipation area and enhancing heat exchange performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If heat pipes are used to transfer heat, then heat dissipation capability is improved, but the heat pipe cannot be folded to cross hinges, limiting heat dissipation area

Engineering Contradiction:

Improveheat dissipation capabilityVSAvoidfoldability to cross hinge

Core Design Contradiction:

Loss of energyVSAdaptability or versatility

Solution Approach 1:

The patent replaces rigid heat pipes with flexible phase change films and graphite films that can be folded and disposed across the hinge of the laptop, enabling heat transfer between the keyboard side and screen side while maintaining the required adaptability to the device's folding structure

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The patent extends heat dissipation from a single-plane approach to a multi-dimensional approach by disposing heat dissipation elements on both the keyboard side and screen side, and using phase change materials that can transfer heat across the hinge dimension, effectively multiplying the heat dissipation area

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Adaptability or versatility

If phase change film and graphite film are used to cross hinge, then foldability is improved, but heat dissipation capability is insufficient

Engineering Contradiction:

Improvefoldability to cross hingeVSAvoidheat dissipation capability

Core Design Contradiction:

Adaptability or versatilityVSLoss of energy

Solution Approach 1:

The patent combines multiple heat dissipation approaches by integrating phase change films, graphite films, and natural heat dissipation elements across both sides of the laptop, creating a hybrid heat dissipation system that leverages the advantages of each method to achieve both foldability and sufficient heat dissipation capability

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent divides the heat dissipation system into multiple segments including heat dissipation elements on the keyboard side, heat dissipation elements on the screen side, and phase change materials at the hinge, allowing each segment to perform optimized heat transfer functions while collectively achieving comprehensive heat dissipation

Inventive Principle:

Principle #1Segmentation

3Loss of energy

If heat dissipation area is increased, then natural heat dissipation capability is improved, but device structure becomes more complex

Engineering Contradiction:

Improvenatural heat dissipation capabilityVSAvoidheat dissipation system structure

Core Design Contradiction:

Loss of energyVSDevice complexity

Solution Approach 1:

The patent designs heat dissipation elements that serve multiple functions: they dissipate heat from processors, transfer heat across the hinge via phase change, and provide thermal management for different components throughout the device, thereby increasing heat dissipation area without proportionally increasing system complexity

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The system effectively balances heat distribution and increases the heat dissipation area, improving thermal management and reducing the risk of liquid leakage while maintaining a compact and lightweight design.

Implementation Method 1

the driving apparatus may be configured to drive the liquid medium to flow in the circulation channel

Methodology Applied

Scientific EffectForced Convection: Forced Convection

Implementation Method 2

The first heat dissipation panel, the second heat dissipation panel, the first rotating shaft assembly, and the second rotating shaft assembly may form a circulation channel of a liquid medium

Methodology Applied

Scientific EffectHeat Conduction: Conduction (thermal)

Data Source

PatentUS12446187B2Heat dissipation system and electronic device

Publication Date: 2025.10.14 HUAWEI TECH CO LTD

AI summary

A heat dissipation system includes a first heat dissipation panel, a second heat dissipation panel, a first rotating shaft assembly, a second rotating shaft assembly, and a driving apparatus. The first heat dissipation panel is provided with a first liquid channel, and the first liquid channel includes a first interface and a second interface. The second heat dissipation panel is provided with a second liquid channel, and the second liquid channel includes a third interface and a fourth interface. The first interface is in communication with the third interface through the first rotating shaft assembly, and the second interface is in communication with the fourth interface through the second rotating shaft assembly. The driving apparatus is configured to drive a liquid medium to flow between the first heat dissipation panel and the second heat dissipation panel.