Liquid-Cooled Power Module for High-Power Charging Heat Dissipation
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Solution Overview
Problem
Current air-cooling heat dissipation methods in charging devices for electric vehicles are inadequate for high-power ultra-fast charging, leading to reduced reliability and shortened service life of power components.
Innovation Solution
A power module with a liquid-cooling system that includes a circuit board, power component, heat conductor, and liquid cooling component, where the power component is fastened to the circuit board and connected via a pin and heat conductor to the liquid cooling component, allowing for efficient heat exchange and dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If air-cooling heat dissipation is used for the power component, then the device complexity is reduced, but the heat dissipation effect is poor and cannot meet the heat dissipation requirement during high-power operation
Solution Approach 1:
The patent applies liquid cooling technology to replace air cooling for heat dissipation. The liquid cooling component includes cooling channels through which cooling liquid flows to carry away heat from the power component body and pin, providing efficient heat dissipation that meets high-power operation requirements.
Solution Approach 2:
The patent introduces heat conductors as intermediary components to transfer heat from the power component pin to the liquid cooling component. The heat conductor establishes a thermal pathway that enables effective heat transfer from areas that would otherwise be difficult to cool, improving overall heat dissipation effectiveness.
2Ease of manufacture
If air-cooling heat dissipation is used for the power component, then the manufacturing cost is reduced, but the service life and reliability of the power component are affected
Solution Approach 1:
The liquid cooling system with cooling channels provides sustained effective heat dissipation, preventing overheating and thermal damage to the power component. This maintains operational reliability and extends service life during prolonged high-power charging operations.
3Reliability
If liquid-cooling heat dissipation is used for both the power component body and the pin, then the heat dissipation efficiency is improved, but the device complexity and cost increase
Solution Approach 1:
The patent integrates the liquid cooling component design to efficiently cool both the power component body and pin through a unified cooling system. The cooling channels and heat conductors are configured to simultaneously address thermal management needs of multiple components, avoiding the need for separate cooling systems.
Solution Approach 2:
The liquid cooling component serves multiple functions: it cools the power component body directly through contact, transfers heat from the pin through heat conductors, and provides a unified thermal management solution for the entire power component assembly, improving efficiency without proportionally increasing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The liquid-cooling system enhances heat dissipation efficiency, meeting high-power operation requirements, prolonging the service life and improving reliability of the power module, and enabling ultra-fast charging speeds of one kilometer per second.
Implementation Method 1
The liquid cooling component is configured to exchange heat with the power component body and the heat conductor
Implementation Method 2
The power component body is in heat-conducting connection to the liquid cooling component, and the pin is in heat-conducting connection to the liquid cooling component via the heat conductor
Data Source
Figure 1
Figure 2
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AI summary
Embodiments of this application provide a power module and a charging device. The power module includes a circuit board, a power component, a heat conductor, and a liquid cooling component, where the power component is located between the circuit board and the liquid cooling component. The power component includes a power component body and a pin, and the power component body is fastened to a surface of the circuit board via the pin. In addition, the power component body is in heat-conducting connection to the liquid cooling component, and the pin is connected to the liquid cooling component via the heat conductor. In this way, the liquid cooling component can not only exchange heat with the power component body, but also exchange heat with the pin via the heat conductor, to implement liquid-cooling heat dissipation for the power component body and the pin. Further, in embodiments of this application, overall heat dissipation effect of the power component can be improved, and a heat dissipation requirement of the power component during high-power operation can be met, so that the charging device can perform high-power charging on an electric vehicle.