Liquid-Cooled Rack Structure for Dockable Electronics Cooling
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Solution Overview
Problem
Traditional air cooling methods are inadequate for high heat load, high heat flux electronic devices, necessitating the development of aggressive thermal management techniques, particularly for densely packed circuits where power dissipation increases with operating frequency, leading to thermal runaway if heat is not effectively removed.
Innovation Solution
A liquid-cooled cooling apparatus with a thermally conductive material and coolant-carrying channels is mounted to the front of an electronics rack, allowing for slidable docking and undocking of electronic subsystems without disrupting coolant flow, using heat transfer elements to facilitate thermal transport from heat-generating components to the liquid-cooled structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional air cooling methods are used, then device simplicity is maintained, but heat removal effectiveness deteriorates leading to thermal runaway
Solution Approach 1:
The patent transitions from air cooling to liquid cooling by implementing a coolant circulation system with channels, pumps, and heat exchangers. The liquid coolant flows through channels in contact with heat-generating components, efficiently removing heat through convection and phase change, thereby resolving the insufficient heat removal capability of air cooling methods.
Solution Approach 2:
The patent introduces a liquid coolant as an intermediary substance between heat-generating electronic components and the cooling system. The coolant absorbs heat from components through thermal conduction and transports it to heat exchangers, effectively bridging the heat transfer gap that air cooling cannot adequately address.
2Ease of repair
If electronic subsystems are made slidable for docking/undocking, then serviceability is improved, but coolant connection reliability deteriorates due to potential leakage
Solution Approach 1:
The patent divides the cooling system into modular segments: a fixed coolant circulation system with stable channels and a movable electronic subsystem module. The modular design allows the electronic subsystem to be docked or undocked independently while the coolant system remains stationary and sealed, preventing leakage while maintaining serviceability.
Solution Approach 2:
The patent pre-configures the coolant channels and connection interfaces before the electronic subsystem is installed. The cooling structure is prepared in advance with proper sealing mechanisms and alignment features, ensuring that when the subsystem is docked, reliable coolant connections are established without leakage risks.
3Reliability
If heat transfer elements are added to conduct heat from components, then heat removal efficiency is improved, but device complexity increases
Solution Approach 1:
The patent integrates heat transfer elements directly into the electronic subsystem housing and coolant channel structures. By merging the heat transfer function with existing structural components, the system achieves efficient heat conduction without adding separate, complex heat transfer devices, thereby maintaining structural simplicity while improving heat removal efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient heat removal from high heat load electronic devices without breaking coolant connections, reducing the risk of coolant leakage and improving serviceability, while maintaining coolant flow integrity during subsystem docking and undocking.
Implementation Method 1
The liquid-cooled cooling structure includes a thermally conductive material and comprises at least one coolant-carrying channel extending therethrough
Implementation Method 2
at least one coolant-carrying channel extending therethrough
Data Source
AI summary
Liquid-cooled electronics racks and methods of fabrication are provided wherein a liquid-based cooling apparatus facilitates cooling of electronic subsystems when docked within the electronics rack. The cooling apparatus includes a liquid-cooled cooling structure mounted to a front of the rack, and a plurality of heat transfer elements. The cooling structure is a thermally conductive material which has a coolant-carrying channel for facilitating coolant flow through the structure. Each heat transfer element couples to one or more heat-generating components of a respective electronic subsystem, physically contacts the cooling structure when that electronic subsystem is docked within the rack, and provides a thermal transport path from the heat-generating components of the electronic subsystem to the liquid-cooled cooling structure. Advantageously, electronic subsystems may be docked within or undocked from the electronics rack without affecting flow of coolant through the liquid-cooled cooling structure.