Liquid-Cooled Rack Heat Exchanger for EMI Shielding
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Solution Overview
Problem
Rack-mount server systems face challenges in efficiently cooling high-density electronic components while managing increasing electromagnetic interference (EMI) emissions, which necessitates effective space utilization and cost reduction.
Innovation Solution
A cooling system incorporating a heat exchanger with a liquid circulation path and an airflow path structure that transfers heat and shields EMI, utilizing materials with high heat conductivity and electromagnetic absorption properties, such as metals and ceramics, to facilitate efficient cooling and EMI shielding in a compact design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If separate cooling and EMI shielding structures are used, then cooling and shielding functions are achieved, but space and cost increase
Solution Approach 1:
The patent combines the cooling function and EMI shielding function into a single integrated heat exchanger structure. The heat exchanger includes both cooling channels for liquid circulation and EMI shielding layers, eliminating the need for separate cooling systems and EMI shielding structures, thereby reducing space utilization and component count.
Solution Approach 2:
The heat exchanger is designed as a multi-functional component that simultaneously performs cooling and EMI shielding. The structure includes cooling channels for thermal management and integrated EMI shielding layers made of conductive materials, allowing one component to fulfill multiple protective and functional roles.
2Productivity
If high-density electronic components are deployed, then productivity increases, but heat density and EMI emissions increase
Solution Approach 1:
The heat exchanger is positioned in close proximity to high-density electronic components to provide localized cooling where heat generation is most intense. The liquid cooling channels are strategically arranged to target specific hot spots, and EMI shielding layers are placed near components generating significant electromagnetic interference, providing customized thermal and electromagnetic management for different zones.
3Temperature
If traditional cooling systems are used, then cooling function is achieved, but space and cost increase
Solution Approach 1:
The EMI shielding layers are integrated within the walls and structure of the heat exchanger itself, nesting the shielding function inside the cooling component. This nested design allows the EMI shielding material to be part of the heat exchanger structure rather than an external addition, significantly reducing the overall system volume while maintaining both cooling and shielding functions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves efficient cooling and EMI shielding in a single component, reducing space and cost within the rack-mounted server system, while allowing for flexible configuration based on heat densities and component placement.
Implementation Method 1
an airflow path structure in thermal contact with the liquid circulation path structure such that heat from air passing through the airflow path structure transfers to the coolant
Implementation Method 2
the airflow path structure is configured to shield electromagnetic interference
Data Source
AI summary
A cooling system for a rack-mount server includes a fan disposed within the rack-mount server and configured to produce an airflow through the rack-mount server, and a heat exchanger disposed within the rack-mount server in a path of the airflow through the rack-mount server. The heat exchanger includes a liquid circulation path structure and an airflow path structure. The airflow path structure is configured to shield electromagnetic interference.