Liquid-Cooled Rack Layout for Dense Server Heat Dissipation

The patent divides the traditional single-rack configuration into multiple independent racks (first rack, second rack, third rack) arranged in parallel. Each rack contains a subset of data processing devices, creating separate thermal zones that can be cooled independently. This segmentation reduces heat concentration in any single location and improves overall heat dissipation efficiency while maintaining high device density across the system.

The patent transitions from a single-column vertical stacking arrangement to a multi-rack parallel arrangement that utilizes horizontal spatial distribution. By arranging racks side-by-side with spacing between them, the system creates additional thermal management dimensions, allowing cooling fluids to flow through multiple parallel paths and improving heat dissipation capacity without sacrificing computing power density.

The patent segments the vertically stacked devices into multiple racks distributed horizontally. Instead of one tall stack, there are several shorter racks arranged parallel to each other, creating intermediate air spaces between racks that facilitate convection currents and heat dissipation while maintaining high overall space utilization.

The patent introduces cooling fluid channels and air gaps as intermediary spaces between racks and within rack structures. These intermediary spaces act as thermal pathways that mediate heat transfer from devices to the cooling system, enabling effective heat dissipation while maintaining compact vertical arrangements within each rack.

The patent implements universal cooling rack structures that can accommodate multiple types of data processing devices (servers, storage devices, networking devices) with different cooling requirements. The rack-level cooling infrastructure serves as a multi-functional platform that provides thermal management for diverse device types without requiring complex device-specific cooling modifications.

The patent introduces cooling racks as intermediary thermal management components between the devices and the cooling fluid supply system. Rather than embedding complex cooling channels directly in each device, the racks serve as intermediate heat exchangers that collect heat from multiple devices and transfer it to the cooling fluid, simplifying the thermal management architecture.