Liquid-Cooled Radiator with Parallel Boards and Diverting Block
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Solution Overview
Problem
Server systems with limited space face reduced overall heat dissipation performance due to the temperature difference and sequential reduction in heat dissipation efficiency across liquid-cooled plates in traditional liquid-cooled radiators.
Innovation Solution
A liquid-cooled radiator design where multiple liquid-cooled boards are connected in parallel, with a single driver providing coolant at a consistent temperature to all boards, and a diverting block system that prevents pipe entanglement and facilitates efficient heat dissipation through parallel coupling and adjustable mounting for inconsistent chip heights.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If liquid-cooled plates are connected in series, then the coolant flows through all plates, but the temperature difference between the first and last plate becomes large, reducing heat dissipation performance
Solution Approach 1:
The liquid-cooled radiator is divided into multiple independently connected liquid-cooled boards that are coupled in parallel to the driver, rather than being connected in series. This segmentation allows each board to receive coolant at the same temperature simultaneously, eliminating the temperature difference that occurs in series connections and maintaining consistent heat dissipation performance across all boards.
2Productivity
If multiple liquid-cooled boards are used, then heat dissipation capacity increases, but pipe entanglement and installation complexity increase
Solution Approach 1:
The liquid-cooled boards are arranged in a parallel configuration where multiple boards extend in the same direction from the driver, utilizing spatial arrangement to avoid pipe entanglement. This dimensional organization allows coolant to be distributed to multiple boards simultaneously without requiring complex piping, simplifying both the structure and installation process while maintaining high heat dissipation capacity.
3Stability of the object's composition
If liquid-cooled boards are fixed in position, then structure is stable, but installation is difficult when chip heights are inconsistent
Solution Approach 1:
The liquid-cooled boards are designed with adjustable positioning capabilities, allowing them to be flexibly positioned according to the actual height requirements of different chips. This dynamic adjustment feature enables the boards to adapt to inconsistent chip heights during installation, improving ease of operation while maintaining structural stability once positioned.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design maintains consistent performance across all liquid-cooled boards, enhances heat dissipation efficiency, improves installation efficiency, and reduces component damage during transportation by ensuring uniform coolant temperature and flexible board positioning.
Implementation Method 1
coolant in a liquid-cooled radiator is driven by a water pump to enter a liquid-cooled plate
Implementation Method 2
returned to a condenser by the liquid-cooled plate to be cooled
Data Source
AI summary
A liquid-cooled radiator includes liquid-cooled boards, a condenser, a driver, a coolant conduit assembly, and a mounting bracket. The liquid-cooled boards and the condenser are mounted on the mounting bracket. The driver is coupled to the liquid-cooled boards and the condenser through the coolant conduit assembly. The coolant conduit assembly includes a main conduit, a diverting block, and a sub-conduit. The diverting block is mounted to the mounting bracket. The liquid-cooled boards are coupled to the diverting block in parallel through the sub-conduit. The condenser, the driver, and the diverting block are coupled together through the main conduit. The driver drives coolant from the condenser to flow through the diverting block and the sub-conduit to the liquid-cooled boards, flow through the sub-conduit and the diverting block to the main conduit, and then flow from the main conduit to the condenser to be condensed.