Liquid-Cooled Server Layout for Modular PCIe GPU Cooling
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Solution Overview
Problem
The complexity of applying liquid cooling technology to PCIe version GPUs in servers due to their independent structure and variable mounting positions, which requires separate cooling plates and connectors, complicates maintenance and increases power consumption.
Innovation Solution
A liquid-cooled server design with a chassis and a liquid-cooling heat dissipation system that includes a liquid cooling loop, conversion device, and leakage detection system, allowing flexible configuration and efficient heat removal for CPUs, memory banks, and PCIe version GPUs, with integrated cooling assemblies and quick connectors to maintain a sealed liquid loop.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If liquid cooling technology is applied to PCIe version GPUs with independent structures and variable mounting positions, then cooling effectiveness is improved, but system complexity increases due to requiring separate cooling plates and connectors for each GPU card
Solution Approach 1:
The patent applies universality by designing a standardized cooling plate and connector assembly that can be used across multiple PCIe GPU cards with different mounting positions. The universal connector interface allows the same cooling plate design to accommodate various GPU configurations, reducing the need for custom cooling solutions for each card while maintaining effective cooling performance.
Solution Approach 2:
The patent segments the cooling system into modular components including standardized cooling plates, connectors, and liquid flow paths. Each PCIe GPU card can be equipped with its own cooling plate that connects to the main liquid cooling loop through standardized interfaces, allowing independent cooling of each card while maintaining system-wide cooling efficiency.
2Temperature
If each PCIe version GPU card is equipped with independent cooling plates and liquid supply/return connectors, then cooling requirements of each GPU card are met, but maintenance complexity and power consumption increase
Solution Approach 1:
The patent implements dynamic maintenance capabilities by designing the cooling system with hot-swappable connectors and modular cooling plates. This allows individual GPU cooling assemblies to be removed, replaced, or maintained without shutting down the entire system or affecting other GPU cards, significantly reducing maintenance complexity and downtime.
Solution Approach 2:
By segmenting the cooling system into independent modular units with standardized interfaces, each GPU card's cooling assembly can be maintained separately. The segmentation allows technicians to access and service individual cooling components without disassembling the entire cooling system, simplifying repair procedures.
3Adaptability or versatility
If multiple quick connectors are added on PCIe version GPU cards to form liquid loops, then flexible configuration is achieved, but reliability decreases due to increased connection points for potential leaks
Solution Approach 1:
The patent applies universality by designing standardized quick connectors that serve multiple functions: they provide flexible configuration options for different GPU arrangements while maintaining consistent sealing interfaces. The universal connector design ensures uniform quality control and sealing performance across all connection points, reducing variability-related leak risks.
Solution Approach 2:
The patent incorporates leak detection mechanisms that provide feedback on the integrity of liquid loop connections. Sensors monitor for leaks at connector interfaces and can alert operators or automatically adjust system parameters to prevent catastrophic failures, compensating for the increased number of connection points through active monitoring.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ensures reliable operation of CPUs, memory banks, and GPUs within normal temperature ranges, significantly increasing liquid cooling's proportion in total power consumption to reduce data center PUE, and enhances maintenance safety by detecting and preventing liquid leaks.
Implementation Method 1
cooling liquid is used as a heat conduction medium to bring heat out of a server through a component such as a cooling plate that in a manner of being in contact with a heating component of the server
Implementation Method 2
cooling liquid is used as a heat conduction medium to bring heat out of a server through a component such as a cooling plate
Data Source
AI summary
Disclosed is a liquid-cooled server, including a chassis and a liquid-cooling heat dissipation system. The chassis has an accommodating cavity, a main control panel, a central processing unit, a memory bank, and a graphics processing unit are arranged inside the accommodating cavity, the central processing unit, the memory bank, and the graphics processing unit are electrically connected to the main control panel; the liquid-cooling heat dissipation system is at least partially located inside the accommodating cavity, the liquid-cooling heat dissipation system includes a liquid cooling loop, a cooling liquid in the liquid cooling loop flows through a liquid cooling plate at the central processing unit, a liquid cooling assembly at the memory bank, and the graphics processing unit, and removes heat generated by the central processing unit and heat generated by the memory bank, and removes heat generated by the graphics processing unit.