Liquid-Cooled Switching Module With Nested Heat Transfer Bodies
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing liquid-cooled power electronics systems have insufficient cooling capacity, leading to inadequate heat dissipation from switching devices, which can result in overheating and potential destruction.
Innovation Solution
A power electronics system with a liquid cooling device comprising two partial bodies connected in a materially-bonded and fluid pressure-tight manner, featuring a cooling volume region with heat transfer bodies that enhance heat transfer from a switching device to a coolant liquid, where the second partial body is arranged in a recess of the first partial body, and the coolant liquid flows through the system from an inlet volume region to an outlet volume region.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional liquid cooling device with a single chamber is used, then the structure is simple, but the cooling capacity is insufficient
Solution Approach 1:
The liquid cooling device is divided into a first partial body and a second partial body, which are connected in a materially-bonded manner. This segmentation allows the cooling device to achieve better cooling capacity through the integrated heat transfer surfaces while maintaining structural manageability.
Solution Approach 2:
The second partial body is arranged in a recess of the first partial body, creating a nested configuration. This nesting approach maximizes the heat transfer surface area within a compact volume, improving cooling capacity without proportionally increasing the overall device size.
2Temperature
If heat transfer bodies are added to enhance cooling, then the heat transfer efficiency improves, but the device complexity increases
Solution Approach 1:
Heat transfer bodies are strategically positioned within the cooling volume region to optimize heat transfer at critical locations. This localized enhancement focuses cooling resources where they are most needed, improving overall heat transfer efficiency without uniformly increasing complexity throughout the entire device.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The enhanced heat transfer design improves the dissipation of thermal energy from the switching device to the cooling medium, effectively preventing overheating and increasing the reliability of the power electronics system.
Implementation Method 1
heat transfer from the switching device to a coolant liquid is improved
Implementation Method 2
heat transfer bodies protruding into the cooling volume region from the second partial body
Data Source
AI summary
A power electronics system has a switching device and a liquid cooling device. A switching device has a plate element, and power semiconductor devices are arranged on conductor tracks and connected by means of a connecting device, wherein the liquid cooling device has a first partial body having an inlet volume region and an outlet volume region and a second partial body. A cooling volume region is formed between the two partial bodies, wherein heat transfer bodies protrude into the cooling volume region from the second partial body. The second partial body is arranged in a recess of the first partial body and the two partial bodies are connected to each other and have a common plane surface which forms a first main surface.