Liquid-Cooled Power Conversion Module for Dense UPS Thermal Management
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Solution Overview
Problem
Conventional uninterruptible power supplies face low heat dissipation efficiency for power conversion modules, especially in high-density device arrangements, leading to noise and reduced dustproof and waterproof capabilities.
Innovation Solution
Implementing a power conversion module with stacked first and second power conversion boards and a liquid cooling board, where heat dissipation is achieved through liquid cooling, eliminating the need for ventilation structures and enhancing thermal conduction paths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If air cooling is used for power conversion modules, then the structure is simple, but the heat dissipation efficiency is low in high-density arrangements
Solution Approach 1:
The patent applies liquid cooling technology by introducing a liquid cooling board with cooling channels that circulate coolant to directly remove heat from power conversion modules. This hydraulic cooling system replaces conventional air cooling, achieving superior heat dissipation efficiency in high-density cabinet arrangements while maintaining acceptable structural complexity through integrated cooling plates and channels.
2Temperature
If ventilation structures are added to improve heat dissipation, then heat dissipation efficiency improves, but dustproof and waterproof performance deteriorates
Solution Approach 1:
The liquid cooling system uses sealed cooling channels and plates that circulate coolant internally, eliminating the need for external ventilation openings. This closed-loop hydraulic system provides effective heat dissipation while maintaining complete sealing of the power conversion module, thereby preserving high dustproof and waterproof performance without requiring air intake or exhaust structures.
3Power
If device density in cabinet is increased, then power capacity increases, but heat dissipation efficiency decreases
Solution Approach 1:
The liquid cooling system with cooling plates and channels provides high-heat-flux removal capability that scales effectively with increased device density. The direct liquid contact cooling method maintains efficient heat transfer even when multiple power conversion modules are tightly packed in the cabinet, allowing higher power capacity without the heat dissipation penalties that would normally accompany increased density.
4Temperature
If liquid cooling board is placed between power conversion boards, then heat dissipation efficiency improves, but manufacturing complexity increases
Solution Approach 1:
The liquid cooling board is integrated between the power conversion boards as a shared thermal management component. The cooling plate combines heat dissipation functions for multiple power modules simultaneously, with coolant channels that service both upper and lower power conversion boards. This merged approach achieves superior heat dissipation while limiting manufacturing complexity through a unified, modular cooling structure rather than separate cooling systems for each board.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves high heat dissipation efficiency with reduced noise, improved dustproof and waterproof performance, and compact module sizes by utilizing liquid cooling between the power conversion boards.
Implementation Method 1
thermal conduction paths from the first power conversion board and the second power conversion board to the liquid cooling board are short
Implementation Method 2
heat dissipation for the first power conversion board and the second power conversion board are both realized through liquid cooling by the liquid cooling board
Data Source
AI summary
Provided in the present disclosure are a power conversion module and an uninterruptible power supply, which relates to the technical field of uninterruptible power supplies. The power conversion module includes a first power conversion board, a second power conversion board and a liquid cooling board. The first power conversion board, the liquid cooling board and the second power conversion board are stacked along a thickness direction of the liquid cooling board, the liquid cooling board is located between the first power conversion board and the second power conversion board, and two side surfaces of the liquid cooling board in the thickness direction are respectively connected to the first power conversion board and the second power conversion board. In this way, a heat dissipation efficiency of the power conversion module is improved.


