Liquid Cooling Assembly with Elastic Support for Storage Modules

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Solution Overview

Problem

Conventional liquid cooling apparatuses for electronic devices face issues with damage to thermally conductive interface materials due to abrasion during insertion and removal of storage modules, and they often have high thermal resistance in heat transfer due to the need for additional gaskets and separate components.

Innovation Solution

A liquid cooling assembly with two heat conducting plates connected to a single liquid cooling tube via flexible connectors, such as elastic metal sheets or soft metal straps, and an elastic support like an elastic reed or U-shaped stopper to ensure tight attachment and easy separation, reducing the need for additional gaskets and enhancing heat conduction.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the storage module is inserted into or removed from the slot, then the thermally conductive interface material is compressed to achieve effective contact with the heat conducting plate, but the heat conducting gasket is abraded and damaged

Engineering Contradiction:
Improvethermal contact reliabilityVSAvoidservice life of heat conducting gasket
Core Design Contradiction:
ReliabilityVSDuration of action of stationary object

Solution Approach 1:

The heat conducting gasket is designed to be detachable from the heat conducting plate, allowing it to remain fixed on the plate during storage module insertion and removal operations. The gasket is only temporarily detached when cleaning or replacement is needed, transforming from a static component subject to repeated abrasion to a dynamic component that stays in place during problematic operations.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The heat conducting gasket is extracted from the integrated heat conducting plate structure and made into a separate, detachable component. This allows the gasket to be removed independently for cleaning or replacement without damaging the heat conducting plate or requiring replacement of the entire assembly, thereby extending the service life of the gasket.

Inventive Principle:
Principle #2Taking out (Extraction)

2Reliability

If additional heat conducting gaskets are added to ensure effective contact, then thermal contact is improved, but thermal resistance during heat transfer increases

Engineering Contradiction:
Improvethermal contact reliabilityVSAvoidthermal resistance
Core Design Contradiction:
ReliabilityVSLoss of energy

Solution Approach 1:

The unnecessary heat conducting gasket between the heat conducting plate and the liquid cooling tube is extracted and removed from the system. The liquid cooling tube is directly connected to the heat conducting plate, eliminating the additional thermal resistance introduced by extra gasket layers while maintaining effective thermal contact through the direct connection.

Inventive Principle:
Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution prolongs the service life of heat conducting gaskets by preventing abrasion and reduces thermal resistance during heat transfer, allowing for reliable and efficient heat dissipation with increased durability and performance.

Implementation Method 1

an elastic support, disposed between the two heat conducting plates and configured to apply elastic pressure to the heat conducting plates during attachment between the heat conducting plates and the storage modules

Methodology Applied
Scientific EffectElasticity: Elasticity

Implementation Method 2

A liquid cooling assembly includes two heat conducting plates, a liquid cooling tube, and an elastic support... configured to perform heat dissipation on a storage module... configured to perform liquid cooling on the heat conducting plates

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS12058839B2Cooling assembly and liquid cooling apparatus
Publication Date: 2024.08.06 CELESTICA TECH CONSULTANCY SHANGHAI
  • US12058839B2 patent drawing
  • US12058839B2 patent drawing
  • US12058839B2 patent drawing

AI summary

The present disclosure provides a liquid cooling assembly and a liquid cooling apparatus. The liquid cooling assembly includes: two heat conducting plates, configured to perform heat dissipation on a storage module attached to each of the heat conducting plates; a liquid cooling tube, disposed on an end of the each heat conducting plates and configured to perform liquid cooling on the heat conducting plates; and an elastic support, disposed between the two heat conducting plates and configured to apply elastic pressure to the heat conducting plates during attachment between the heat conducting plates and the storage modules, to cause the heat conducting plates to be tightly attached to surfaces of the storage modules, and cause the storage modules to be easily separated from the heat conducting plates after the elastic support is removed from the two heat conducting plates.