Liquid Cooling Assembly with Elastic Support for Storage Modules
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Solution Overview
Problem
Conventional liquid cooling apparatuses for electronic devices face issues with damage to thermally conductive interface materials due to abrasion during insertion and removal of storage modules, and they often have high thermal resistance in heat transfer due to the need for additional gaskets and separate components.
Innovation Solution
A liquid cooling assembly with two heat conducting plates connected to a single liquid cooling tube via flexible connectors, such as elastic metal sheets or soft metal straps, and an elastic support like an elastic reed or U-shaped stopper to ensure tight attachment and easy separation, reducing the need for additional gaskets and enhancing heat conduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the storage module is inserted into or removed from the slot, then the thermally conductive interface material is compressed to achieve effective contact with the heat conducting plate, but the heat conducting gasket is abraded and damaged
Solution Approach 1:
The heat conducting gasket is designed to be detachable from the heat conducting plate, allowing it to remain fixed on the plate during storage module insertion and removal operations. The gasket is only temporarily detached when cleaning or replacement is needed, transforming from a static component subject to repeated abrasion to a dynamic component that stays in place during problematic operations.
Solution Approach 2:
The heat conducting gasket is extracted from the integrated heat conducting plate structure and made into a separate, detachable component. This allows the gasket to be removed independently for cleaning or replacement without damaging the heat conducting plate or requiring replacement of the entire assembly, thereby extending the service life of the gasket.
2Reliability
If additional heat conducting gaskets are added to ensure effective contact, then thermal contact is improved, but thermal resistance during heat transfer increases
Solution Approach 1:
The unnecessary heat conducting gasket between the heat conducting plate and the liquid cooling tube is extracted and removed from the system. The liquid cooling tube is directly connected to the heat conducting plate, eliminating the additional thermal resistance introduced by extra gasket layers while maintaining effective thermal contact through the direct connection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution prolongs the service life of heat conducting gaskets by preventing abrasion and reduces thermal resistance during heat transfer, allowing for reliable and efficient heat dissipation with increased durability and performance.
Implementation Method 1
an elastic support, disposed between the two heat conducting plates and configured to apply elastic pressure to the heat conducting plates during attachment between the heat conducting plates and the storage modules
Implementation Method 2
A liquid cooling assembly includes two heat conducting plates, a liquid cooling tube, and an elastic support... configured to perform heat dissipation on a storage module... configured to perform liquid cooling on the heat conducting plates
Data Source
AI summary
The present disclosure provides a liquid cooling assembly and a liquid cooling apparatus. The liquid cooling assembly includes: two heat conducting plates, configured to perform heat dissipation on a storage module attached to each of the heat conducting plates; a liquid cooling tube, disposed on an end of the each heat conducting plates and configured to perform liquid cooling on the heat conducting plates; and an elastic support, disposed between the two heat conducting plates and configured to apply elastic pressure to the heat conducting plates during attachment between the heat conducting plates and the storage modules, to cause the heat conducting plates to be tightly attached to surfaces of the storage modules, and cause the storage modules to be easily separated from the heat conducting plates after the elastic support is removed from the two heat conducting plates.


