Liquid Cooling Fin Layout for Bubble-Free Channel Bends
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Solution Overview
Problem
Conventional liquid cooling assemblies experience severe bubble generation at bends in medium flow channels, leading to discrepancies in heat dissipation performance and temperature uniformity across chips, which hinders optimal performance in ultra-high-performance computing devices.
Innovation Solution
A liquid-cooled computing module with a liquid cooling assembly featuring discontiguous heat dissipation fins, including curved and straight plate portions, that guide medium flow smoothly through bends, avoiding turbulence and bubble formation, while maintaining consistent flow velocity and temperature uniformity across the width direction of the flow channels.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional liquid cooling assemblies use bends in medium flow channels, then the cooling assembly can be compact and efficient, but severe bubble generation occurs at bends causing poor temperature uniformity
Solution Approach 1:
The patent applies curvature by designing the heat dissipation fins with curved portions that follow the bend geometry of the medium flow channel. The curved portions are convex and smooth, matching the curvature of the channel bend, which guides the medium flow smoothly through the bend without causing turbulence or bubble generation. This resolves the contradiction by maintaining temperature uniformity while eliminating harmful bubble formation at bends.
Solution Approach 2:
The patent implements local quality by differentiating the fin structure at different locations: straight plate portions parallel to the channel direction and curved portions at the bends. The curved portions are specifically designed with convex smooth surfaces to guide flow through bends, while straight portions handle linear sections. This localized adaptation eliminates bubble generation at bends while maintaining effective heat dissipation throughout the channel.
2Temperature
If wedge-shaped structures are added at bends to guide medium flow, then bubble generation is reduced to some extent, but temperature uniformity across chips in the width direction still fails to be satisfied
Solution Approach 1:
The patent replaces wedge-shaped structures with curved portions that have convex smooth surfaces matching the bend curvature. This design guides medium flow more effectively through the bend, reducing turbulence and improving temperature uniformity across the width direction. The curved geometry naturally directs flow along the bend path, achieving better results than angular wedge structures while maintaining reasonable complexity.
Solution Approach 2:
The patent changes the geometric parameters of the heat dissipation fins at bend locations, specifically using curved portions with convex smooth surfaces instead of straight or wedge-shaped structures. The curvature radius and surface profile are optimized to match the channel bend, improving flow guidance and temperature uniformity without significantly increasing structural complexity.
3Power
If heat dissipation fins are arranged at bends, then heat dissipation performance is improved, but bubble generation increases due to flow turbulence
Solution Approach 1:
The patent designs heat dissipation fins with curved portions that have convex smooth surfaces matching the bend curvature. These curved portions guide medium flow smoothly through the bend, preventing turbulence and bubble generation while maintaining effective heat dissipation. The fins are strategically positioned at bends with curved geometries that follow the flow path, ensuring both high heat dissipation performance and bubble-free operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances temperature uniformity among chips, improves operational performance, extends service life, and increases structural strength and anti-noise capabilities of the computing device by ensuring consistent flow velocity and temperature distribution.
Implementation Method 1
the curved portions are convex and smooth curved panel structures... guide the medium flow smoothly through bends, avoiding turbulence and bubble formation
Implementation Method 2
a plurality of heat dissipation fins are juxtaposed within each of the at least two medium flow channels... enhances temperature uniformity among chips
Data Source
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AI summary
Disclosed is a liquid-cooled computing module and a computing device. The liquid-cooled computing module includes a liquid cooling assembly and a hash board. At least two medium flow channels, connected by bends, are formed within the enclosure, and a plurality of heat dissipation fins are juxtaposed within each of the at least two medium flow channels. wherein at a bent connection of two communicated medium flow channels of the at least two medium flow channels, in the plurality of heat dissipation fins within one of the two communicated medium flow channels, some are contiguous fins and some are discontiguous fins, wherein the contiguous fins are arranged contiguously at least at the bent connection, and the discontiguous fins include straight plate portions and curved portions that are spaced apart, wherein the straight plate portions are parallel to a straight segment of the medium flow channel, the curved portions are disposed closer to the other of the two communicated medium flow channels than the straight plate portions, the curved portions are convex and smooth curved panel structures, and first ends of the curved portions away from the straight plate portions protrude beyond the contiguous fins. According to the present disclosure, the uniformity of the flow velocity and temperature of a medium flow in a width direction of the medium flow channel is increased, and the heat dissipation performance of the liquid cooling assembly is improved.