Liquid Cooling Block Isolation for High-Current Power Flow Units
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Solution Overview
Problem
Modern power flow control systems face challenges with air cooling, which is inadequate for managing the high thermal loads generated by high current devices in distributed power generation and distribution systems, necessitating the adoption of liquid cooling configurations.
Innovation Solution
A liquid cooling block (LCB) with input and output ports, a closed-circuit fluid assembly, and a pump to circulate liquid coolant, featuring showerheads with jetting apertures that impinge on a cooling plate or thermally coupled metal members, integrated into power flow control units and systems to efficiently manage heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If air cooling is used for heat dissipation in power flow control systems, then the system structure is simple, but the cooling effectiveness is insufficient for high thermal loads
Solution Approach 1:
The patent applies hydraulic cooling by circulating liquid coolant through channels formed in the insulating substrate. The coolant flows through these channels to absorb heat from the high current devices, providing effective heat dissipation while maintaining a compact structure. This resolves the contradiction by replacing air cooling with liquid hydraulic cooling, which offers superior heat transfer capability.
Solution Approach 2:
The patent creates cooling channels specifically within the insulating substrate in close proximity to the high current devices that generate heat. This localized cooling approach targets the thermal hotspots directly, providing efficient heat removal from critical components without requiring complex external cooling systems throughout the entire device.
2Temperature
If liquid cooling is implemented to manage high thermal loads, then cooling effectiveness improves, but device complexity increases
Solution Approach 1:
The patent merges the cooling function with the insulating substrate structure by forming cooling channels directly within the substrate material. This integration combines the electrical insulation function with the thermal management function in a single component, eliminating the need for separate cooling systems and reducing overall device complexity despite the advanced cooling capability.
Solution Approach 2:
The insulating substrate serves multiple functions simultaneously: it provides electrical insulation between high voltage and low voltage components, structural support for the device, and a heat dissipation pathway through its internal cooling channels. This multi-functionality reduces the need for additional dedicated cooling components, thereby managing thermal loads without proportionally increasing device complexity.
3Temperature
If cooling channels are formed in insulating substrate, then heat dissipation efficiency increases, but manufacturing difficulty increases
Solution Approach 1:
The patent utilizes the dielectric properties and material characteristics of the insulating substrate to enable channel formation through appropriate manufacturing processes. By selecting substrates with suitable mechanical and thermal properties, the cooling channels can be formed using techniques such as drilling, machining, or additive manufacturing, balancing heat dissipation efficiency with manufacturing feasibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The liquid cooling configuration effectively manages high thermal loads, enabling power flow control systems to inject substantial reactive power into transmission lines while maintaining reliable operation and longevity, with features like redundant pumps and temperature monitoring for enhanced reliability.
Implementation Method 1
an electronic assembly is thermally coupled to the cooling plate
Implementation Method 2
A pump is used to circulate liquid coolant within the LCB and within the closed-circuit fluid assembly
Implementation Method 3
A pump is used to circulate liquid coolant within the LCB and within the closed-circuit fluid assembly
Data Source
AI summary
A modular liquid cooling block is described for cooling high current devices deployed in power flow control systems. The liquid cooling blocks may have separate shower heads which may be configured for direct impingement, indirect impingement, or parallel flow cooling configurations. Voltage isolation of liquid cooling blocks from an enclosure of the power flow control system and from associated equipment enables serial or parallel connected power flow control units to inject substantial reactive power that may be configurable into a power transmission line. Associated power flow control systems are monitored for temperature, flow rate and pressure gradient. Redundant pumps and fan radiators contribute to reliable operation. Automatic shutdown and alarm may be provided.