Liquid Cooling Circular Pipe for Silent Heat Dissipation

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Solution Overview

Problem

Conventional heat dissipation methods in portable and general electronics, as well as LED lighting devices, face challenges such as limited space, increased noise, and reduced efficiency due to the need for larger fans, which can lead to overheating, reduced device lifespan, and noise pollution.

Innovation Solution

A heat dissipation device utilizing a fluid delivery system with a circular pipe that contacts the heat generation device, allowing fluid to flow and absorb heat, which is then dissipated through the pipe, offering a compact, low-noise, and efficient cooling solution.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a heat dissipation fan is installed inside portable electronics devices, then heat dissipation efficiency is improved, but device size increases and internal space is reduced

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoiddevice size

Core Design Contradiction:

ReliabilityVSVolume of moving object

Solution Approach 1:

The patent replaces the conventional mechanical fan-based heat dissipation system with a liquid circulation system. The liquid absorbs heat from the heat-generating component and transports it to a heat dissipation portion, eliminating the need for a mechanical fan and its associated space requirements.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent utilizes liquid (hydraulic principle) as the heat transfer medium. The liquid circulates through pipes in contact with the heat-generating component, absorbing and transporting heat energy to the dissipation portion, providing efficient heat removal without mechanical moving parts.

Inventive Principle:

Principle #29Pneumatics and hydraulics

2Reliability

If a heat dissipation fan is installed to improve heat dissipation, then heat removal capability is enhanced, but noise generation increases

Engineering Contradiction:

Improveheat dissipation capabilityVSAvoidnoise

Core Design Contradiction:

ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The patent eliminates the mechanical fan system that generates noise through rotation and air movement. Instead, it employs a liquid circulation system where heat is transferred through thermal conduction and convection, producing no audible noise during operation.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent converts the potentially harmful effect of liquid circulation (which could create noise if pumped vigorously) into a beneficial silent heat transfer mechanism by relying on natural convection and thermal conduction through contact pipes, transforming the heat transfer process into a noise-free operation.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

3Reliability

If conventional circuit layout is altered to accommodate a fan, then heat dissipation is improved, but manufacturing cost increases

Engineering Contradiction:

Improveheat dissipation performanceVSAvoidmanufacturing cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The liquid circulation system serves multiple functions: heat absorption from the heat-generating component, heat transport through the liquid medium, and heat dissipation at the designated portion. This multi-functional approach eliminates the need for separate fan installation and circuit layout modifications, maintaining manufacturing simplicity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

By replacing the fan-based mechanical heat dissipation system with a liquid circulation system, the patent eliminates the need to alter circuit layouts for fan accommodation. The liquid pipes can be integrated into existing device structures without requiring changes to the electronic circuit arrangement, thereby maintaining ease of manufacture.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The fluid-based heat dissipation system effectively manages heat in compact devices with minimal noise and low power consumption, suitable for various heat generation devices, including portable electronics and LEDs, enhancing their operational stability and lifespan.

Implementation Method 1

at least a portion of the circular pipe itself contacting with a heat generation device for conducting heat to the portion of the circular pipe

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

letting the fluid to be delivered by the fluid delivery device for delivering heat to the rest portion of the circular pipe

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentUS8902591B2Heat dissipation device

Publication Date: 2014.12.02 MICROJET TECH

AI summary

The present invention relates to a heat dissipation device, which comprises: a fluid, a fluid delivery device, and a circular pipe. The fluid delivery device is for propelling and delivering the fluid, the circular pipe is connected with the fluid delivery device, at least a portion of the circular pipe itself contacting with a heat generation device for conducting heat to the portion of the circular pipe, so as letting the fluid to be delivered by the fluid delivery device for delivering heat to the rest portion of the circular pipe, and to dissipate the heat generation device.