Liquid Cooling Module Cold Plate Direct Contact
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Solution Overview
Problem
Existing cooling systems, such as CRAC units, struggle to effectively manage the thermal environment of high-power density racks in data centers, which generate heat at a higher rate due to increased electronic density, leading to potential server failures and performance issues.
Innovation Solution
A liquid cooling module with a configurable frame structure and cold plates that can be adjusted to directly contact IT components, allowing for efficient heat transfer and customizable layout to accommodate different IT equipment configurations, including components on both sides of the PCB.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If CRAC units are used to cool high-power density racks, then the thermal environment of conventional racks can be maintained, but the units are unable to effectively cool high-power density racks due to higher heat generation rates
Solution Approach 1:
The patent transitions from air-based cooling (CRAC units) to liquid-based cooling (cold plates with coolant circulation). The liquid cooling system uses hydraulic principles to directly transfer heat from high-power density components through cold plates that contact the components, enabling effective cooling where air-based systems fail due to the higher heat generation rates of modern high-density electronics.
Solution Approach 2:
The cold plate acts as an intermediary between the heat-generating IT components and the coolant system. The cold plate directly contacts the high-power density components to extract heat, then transfers it to the circulating coolant, providing a more efficient heat transfer pathway compared to direct air cooling by CRAC units.
2Power
If high-density chips are packaged closer together on server PCBs to provide more processing power, then computing performance increases, but heat generation rate increases leading to thermal management issues
Solution Approach 1:
The liquid cooling system replaces conventional air cooling with direct liquid-to-component heat transfer through cold plates. This hydraulic cooling approach can handle the higher heat flux densities generated by closely-packaged high-power chips, maintaining lower operating temperatures that enable sustained high processing power without thermal throttling or failure.
Solution Approach 2:
The cold plate system applies localized cooling directly at the heat-generating components rather than relying on general ambient air cooling. By placing cold plates in direct contact with specific high-power density components, the system provides targeted thermal management where it is most needed, enabling higher local power densities without compromising overall system thermal stability.
3Productivity
If a configurable frame structure with adjustable cold plates is used, then direct contact with IT components can be ensured for efficient heat transfer, but the device complexity increases
Solution Approach 1:
The frame structure incorporates adjustable and reconfigurable elements that allow the cold plates to be dynamically positioned and configured to match different IT component layouts. This dynamic adaptability enables direct thermal contact with various component configurations while maintaining a relatively simple overall structure through modular design principles.
Solution Approach 2:
The configurable frame structure serves multiple functions: it provides structural support for the cold plates, enables adjustment to accommodate different component layouts, and facilitates direct thermal contact. This multi-functionality reduces the need for separate adjustment mechanisms and simplifies the overall device architecture while maintaining heat transfer efficiency across different configurations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The liquid cooling module effectively manages heat from high-power density servers by ensuring direct contact between cold plates and IT components, preventing damage and maintaining optimal thermal conditions, thus enhancing server performance and reliability.
Implementation Method 1
a cold plate that is arranged to come into direct contact with the IT component... when the cold plate is in direct contact with the IT component and heat generated by the IT component is transferred into the liquid coolant
Data Source
AI summary
According to one embodiment, a liquid cooling module includes a chassis, a supply liquid manifold and a return liquid manifold that are both fluidly coupled to a coolant source, a piece of information technology (IT) equipment that is mounted to the chassis and has an IT component, and a frame structure that includes: a pair of primary beams that are coupled to the chassis, a pair of secondary beams, each secondary beam being coupled to both primary beams, and a cold plate that is coupled to the pair of secondary beams. The plate is arranged to come into direct contact with the component. The plate is fluidly coupled to the supply liquid manifold to receive liquid coolant from the source and is fluidly coupled to the return liquid manifold to return warmed coolant to the source that is produced when heat generated by the component is transferred into the coolant.