Liquid Cooling Cold Plate Assembly for Server Heat Dissipation
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Solution Overview
Problem
Conventional heat dissipation methods in servers, relying on fans, are insufficient for efficient heat management, leading to noise and interference with component installation and removal.
Innovation Solution
A liquid cooling device with a cold plate assembly and water divider system that enhances heat dissipation efficiency by using coolant with high specific heat capacity and conductivity, reducing the need for multiple fans and facilitating component installation through an assistance bracket for easy cold plate handling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If fans are used for heat dissipation, then heat can be dissipated from the server, but the heat dissipation efficiency is insufficient and noise is generated
Solution Approach 1:
The patent applies liquid cooling technology using a cooling liquid circulation system instead of air cooling with fans. The cooling liquid flows through cold plates that are thermally coupled to heat-generating components, efficiently transferring heat away from the server. This hydraulic cooling method achieves superior heat dissipation efficiency while operating silently, as the pump-driven liquid circulation produces no audible noise compared to spinning fans.
Solution Approach 2:
The patent replaces the mechanical fan-based air cooling system with a liquid circulation cooling system. Instead of using mechanical fans to force air flow over heat-generating components, the system uses a pump to circulate cooling liquid through thermally conductive cold plates that directly contact the components, substituting mechanical air movement with fluid-based thermal conduction and convection.
2Temperature
If multiple fans are used to improve heat dissipation, then heat dissipation efficiency improves, but the volume of the server increases and interference with component installation occurs
Solution Approach 1:
The liquid cooling system uses compact cold plates that can be directly mounted on heat-generating components without requiring additional space for large fan assemblies. The cooling liquid circulation system achieves high heat dissipation efficiency in a compact form factor, reducing the overall server volume compared to multiple fan configurations.
3Ease of operation
If cold plates are directly handled for installation, then installation can be performed, but the cold plates are difficult to grasp and install due to their shape
Solution Approach 1:
The patent introduces an assistance bracket as an intermediary tool that facilitates the installation of cold plates. The bracket includes engagement holes that allow installation tools to grasp and manipulate the cold plate, making it easier to handle and install despite the cold plate's shape. The bracket acts as a mediator between the installer and the cold plate, simplifying the installation process.
Solution Approach 2:
The assistance bracket is designed as a separate, removable component that is not permanently attached to the cold plate. The engagement holes in the bracket can be selectively engaged with installation tools only during the installation process, and the bracket can be easily removed afterward. This extraction approach allows the cold plate structure to remain simple while providing enhanced installability when needed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The liquid cooling device effectively reduces noise and improves heat dissipation efficiency by 1000 to 3000 times that of air cooling, minimizing volume and interference with component installation, while prioritizing heat transfer to high-power graphics chips.
Implementation Method 1
The first cold plates are respectively and thermally coupled to the bridge chips and each has a first fluid inlet and a first fluid outlet. The second cold plates are respectively and thermally coupled to the graphics chips and each has a second fluid inlet and a second fluid outlet.
Implementation Method 2
The inner inlet connectors are in fluid communication with the outer inlet connector, and the inner outlet connectors are in fluid communication with the outer outlet connector. The first inlet pipe connects one of the inner inlet connectors and the first fluid inlet of one of the first cold plates.
Data Source
AI summary
A liquid cooling device includes first cold plates, second cold plates, a water divider, a first inlet pipe, a first outlet pipe, first connection pipes, second inlet pipes, second outlet pipes, second connection pipes. The water divider has inner inlet connectors and inner outlet connectors. The first inlet pipe connects one inner inlet connector and one first cold plate. The first outlet pipe connects one inner outlet connector and another one first cold plate. The first connection pipes each connect different two of the other first cold plates. The second inlet pipes respectively connect the other inner inlet connectors and some second cold plates. The second outlet pipes respectively connect the other inner outlet connectors and some second cold plates. The second connection pipes each connect different two second cold plates.