Liquid-Cooling Conduit Routing for Cleaner PC Chassis Layout
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Solution Overview
Problem
Existing liquid-cooling devices for computers expose conduits on the motherboard, disrupting the internal layout and aesthetics of the computer chassis.
Innovation Solution
A liquid-cooling heat dissipation device with a carriage device that holds conduits in place, using an L-shaped bracket and a shield to minimize conduit exposure, and includes a fan device for efficient heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If liquid-flow conduits are used to connect the water-cooled block to the radiator, then heat dissipation efficiency is improved, but the internal layout and aesthetics of the computer chassis are degraded
Solution Approach 1:
The patent extracts the conduits from the internal chassis space by routing them through the exterior frame structure. The conduits are positioned in the hollow section of the frame body, allowing them to be removed from the problematic internal layout area while maintaining their heat dissipation function.
Solution Approach 2:
The frame body acts as an intermediary structure that houses the conduits. By placing conduits within the hollow frame section, the frame serves as a mediator between the aesthetic requirements (clean internal layout) and the functional requirements (heat dissipation through conduits).
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Maintains an organized internal layout and improved aesthetics while ensuring smooth liquid flow and protection against conduit detachment and leakage.
Implementation Method 1
a surface of the cooling plate is configured to contact a corresponding surface of the heat-generating component such that heat generated by the heat-generating component is transferred to the cooling plate
Implementation Method 2
the working liquid circulates within the at least two conduits to effect the heat transfer from the heat generating device to the cooling plate
Implementation Method 3
a radiator (a) connected to the water-cooled block (c) through two water conduits (b), whereby the working fluid (usually water) with a certain pressure passes through the water-cooled block (c) to take away the heat from the heat-generating element (d), and flows to the radiator (a) to dissipate the heat
Data Source
AI summary
A liquid-cooling heat dissipation device which comprises a cooling plate, a heat dissipator having a working liquid therein, and at least two conduits connecting the cold plate to the heat dissipator is described. A surface of the cooling plate is configured to contact a heat-generating component, thereby transferring the heat generated by the heat-generating component to the cooling plate and conducting the heat away to the heat dissipator via a working liquid.