Liquid Cooling Confluence Structure for Uniform Chip Temperatures
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing liquid cooling solutions for high-performance computing devices fail to achieve uniform temperature distribution across chips due to significant temperature differences along the width direction of the flow channel, leading to performance issues and potential device malfunctions.
Innovation Solution
A liquid cooling apparatus with a confluence structure between the medium outlet and heat dissipation fins, where the distance between confluence plates increases towards the fins, ensuring uniform flow velocity and temperature across the width of the flow channel, enhancing temperature consistency among chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If liquid cooling plates with heat dissipation fins are used, then heat dissipation capability is improved, but temperature uniformity across chips deteriorates due to significant temperature differences along the width direction of the flow channel
Solution Approach 1:
The flow channel is segmented into multiple sub-channels by partition walls, with each sub-channel serving a specific row of chips. This segmentation allows independent flow control and heat dissipation optimization for different chip rows, ensuring uniform temperature distribution across all chips while maintaining high heat dissipation capability.
Solution Approach 2:
Different regions of the cooling plate are designed with locally optimized features: heat dissipation fins are positioned at specific locations corresponding to high-heat-generation areas, partition walls are strategically placed to control flow distribution, and the outlet is divided into multiple sub-outlets. This local quality optimization ensures each chip row receives appropriate cooling based on its thermal characteristics.
2Temperature
If heat dissipation fins are added to increase heat dissipation area, then heat dissipation efficiency is improved, but flow velocity uniformity across the width direction deteriorates
Solution Approach 1:
The flow channel is divided into multiple sub-channels by partition walls, creating separate flow paths that maintain more uniform velocity distribution across the width direction. Each sub-channel handles a specific row of chips, preventing flow maldistribution and ensuring consistent flow velocity while providing sufficient heat dissipation area through localized fins.
Solution Approach 2:
The problem of flow velocity non-uniformity in the width direction is solved by introducing a new dimension - the partition walls create a third dimension of flow control through the channel depth. This allows independent optimization of flow characteristics in each sub-channel, achieving both high heat dissipation efficiency and uniform flow velocity distribution.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves uniform heat dissipation across chips, improving overall device performance and extending service life by maintaining consistent flow velocities and temperatures, reducing junction temperatures by 1-2°C and enhancing temperature uniformity by 40%.
Implementation Method 1
each of the chips is in contact with a corresponding region of the medium flow channel
Implementation Method 2
a medium flow channel being arranged in the housing, wherein the medium flow channel is in communication with the medium inlet and the medium outlet
Implementation Method 3
a plurality of heat dissipation fins are spaced apart along a width direction of the medium flow channel within the medium flow channel
Data Source
Figure 1
Figure 2
Figure 3
AI summary
Disclosed are a liquid cooling apparatus and an electronic device. The liquid cooling apparatus includes a housing. A medium outlet, a medium inlet, and a medium flow channel are arranged on the housing. A plurality of heat dissipation fins are spaced apart within the medium flow channel. A space between the medium outlet and the heat dissipation fins within the medium flow channel forms a confluence region, wherein a confluence structure is arranged within the confluence region. The confluence structure includes a first confluence plate and a second confluence plate oppositely and spacedly arranged in the width direction, wherein a distance between the first confluence plate and the second confluence plate increases along a direction from the medium outlet towards the heat dissipation fins; and in the extension direction, the confluence structure is spaced apart from the heat dissipation fins.