Liquid Cooling Unit With DX Loop for High-Density Server Racks
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing direct-to-chip liquid cooling systems face challenges in providing high-density cooling without increasing space usage and are hindered by the reliance on condenser fans and chiller systems that are costly and difficult to maintain.
Innovation Solution
A cooling system utilizing a cooling tower in conjunction with a direct expansion (DX) loop and two fluid loops, including a first fluid loop and a second fluid loop, to enhance cooling capacity without expanding the data center footprint, using a configuration that includes a brazed plate heat exchanger and pumps to manage fluid flow and temperature.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional air cooling systems are used to cool electronic devices, then cooling coverage is provided, but cooling density is insufficient and energy consumption increases
Solution Approach 1:
The patent transitions from air cooling to liquid cooling by introducing a cooling fluid circulation system. The liquid cooling system uses a pump to circulate coolant through channels in contact with electronic devices, achieving higher cooling density and lower energy consumption compared to air cooling systems.
Solution Approach 2:
The patent replaces the mechanical air movement system (fans) with a liquid circulation system. The liquid cooling system uses a closed-loop fluid circulation mechanism with pumps and heat exchangers, eliminating the need for high-power cooling fans and reducing overall energy consumption.
2Temperature
If cooling fans are used to force cooling airflow, then heat dissipation is achieved, but acoustic noise increases
Solution Approach 1:
The patent replaces air-based cooling with liquid-based cooling. The liquid circulation system operates quietly compared to high-speed cooling fans, significantly reducing acoustic noise while maintaining effective heat dissipation through the coolant fluid.
3Temperature
If air cooling is used in data centers, then cooling is provided, but dust accumulation increases leading to static electricity and surface degradation
Solution Approach 1:
The patent replaces air cooling with liquid cooling, eliminating the need to blow air through the data center environment. The closed-loop liquid cooling system contacts electronic devices only at localized cooling points, preventing dust circulation and accumulation that occurs with air cooling systems.
4Temperature
If direct-to-chip liquid cooling is implemented, then cooling efficiency increases, but system complexity and maintenance difficulty increase
Solution Approach 1:
The patent divides the liquid cooling system into modular components: cooling plates with integrated channels, external heat exchangers, and pump units. This segmentation allows for easier installation, maintenance, and replacement of individual components without affecting the entire system.
Solution Approach 2:
The patent introduces a heat exchanger as an intermediary component between the cooling fluid loop and the electronic devices. This mediator allows for efficient heat transfer while maintaining system modularity and simplifying maintenance by providing a removable interface for coolant circulation.
5Productivity
If higher-density data centers are built for artificial intelligence, then computing capacity increases, but heat rejection per footprint increases
Solution Approach 1:
The patent implements liquid cooling systems that can handle high heat rejection densities. The cooling fluid circulation system with controlled flow rates and phase-change heat exchangers efficiently removes heat from high-density computing equipment, enabling higher computing capacity per footprint without thermal management bottlenecks.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system provides efficient and cost-effective high-density cooling, reducing energy consumption and maintenance costs while effectively managing heat dissipation in high-density data centers, thereby enhancing the reliability and performance of electronic components.
Implementation Method 1
heat is transferred through conduction and convection as they pass through plates of the BPHE
Implementation Method 2
heat is transferred through conduction and convection as they pass through plates of the BPHE
Implementation Method 3
heat is transferred into a refrigerant causing the refrigerant to evaporate into a gas
Implementation Method 4
heat is transferred into a refrigerant causing the refrigerant to evaporate into a gas
Implementation Method 5
The compressor can pressurize the gas refrigerant to raise the temperature of the refrigerant higher than the ambient temperature air outside
Implementation Method 6
Ambient temperature air is blown across the condenser coil by a fan, and heat is then transferred from the vapor refrigerant to the air
Implementation Method 7
This circulation condenses the refrigerant into a liquid
Implementation Method 8
A cooling tower receives the technical fluid from the second pump and supplies the technical fluid to the cooling tower
Data Source
AI summary
A cooling system for cooling heat-generating components within a building. The cooling system comprises a cooling tower, a first fluid loop, a direct expansion (DX) loop, and a second loop. The first fluid loop communicates with the cooling tower and circulates a cooling tower fluid via a first pump. The DX loop communicates with the cooling tower. The DX loop circulates a refrigerant fluid and comprises an expansion valve and a compressor. The second fluid loop indirectly communicates with the DX loop, the first fluid loop, and the heat-generating components, and circulates a technical fluid via a second pump. The DX loop communicates with the cooling tower via a first brazed plate heat exchanger (BPHE) and communicates with the second fluid loop via a second BPHE. The first fluid loop communicates with the second fluid loop via a third BPHE. The heat-generating components are one or more servers.