Compact Liquid-Cooling Heat Dissipation Device for Expansion Cards
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Solution Overview
Problem
Conventional liquid cooling systems for expansion cards in computers occupy excessive space due to the scattered placement of heat sinks, heat exchangers, and pumps, making it difficult to fit within limited internal spaces while maintaining effective heat dissipation.
Innovation Solution
A compact liquid-cooling heat dissipation device is designed with a base plate, thermally-conductive component, and heat exchanger configuration that stacks to minimize space usage, forming a liquid chamber and utilizing a pump and pipes to enhance heat transfer efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional liquid cooling systems use scattered placement of heat sink, heat exchanger, and pump, then heat dissipation function is achieved, but space occupation becomes excessive
Solution Approach 1:
The patent combines the heat sink, heat exchanger, and pump into a single integrated liquid cooling device that attaches to the expansion card. The heat dissipation components are merged into one unified structure, eliminating the need for separate scattered placements and reducing overall space occupation while maintaining heat dissipation functionality
Solution Approach 2:
The integrated liquid cooling device performs multiple functions within a single component assembly: the heat sink dissipates heat, the heat exchanger transfers heat to coolant, and the pump circulates the coolant. This multi-functional design replaces multiple separate components, achieving both heat dissipation and space reduction goals
2Temperature
If heat sink, heat exchanger, and pump are placed in different locations, then heat dissipation function is maintained, but adaptability to different internal spaces is reduced
Solution Approach 1:
By merging all heat dissipation components into a single integrated unit that attaches directly to the expansion card, the device becomes highly adaptable to different internal computer spaces. The unified structure can be installed in various locations depending on available space, unlike fixed scattered placements
Solution Approach 2:
The patent transitions from a three-dimensional scattered distribution of components to a compact stacked arrangement where components are layered vertically. This dimensional reorganization reduces the device's footprint in the horizontal plane while maintaining all necessary heat dissipation functions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces space occupation while increasing heat dissipation efficiency for expansion cards, allowing for more efficient cooling without significantly increasing the overall volume of the device.
Implementation Method 1
The thermally-conductive component is mounted on the base plate. The thermally-conductive component and the base plate together form a liquid chamber therebetween
Implementation Method 2
The heat exchanger is mounted on the base plate and connected to the liquid chamber
Data Source
AI summary
The disclosure provides a liquid-cooling heat dissipation device. The liquid-cooling heat dissipation device is configured to be in thermal contact with an expansion card. The liquid-cooling heat dissipation device includes a base plate, a thermally-conductive component and a heat exchanger. The base plate is configured to be mounted on the expansion card. The thermally-conductive component is mounted on the base plate. The thermally-conductive component and the base plate together form a liquid chamber therebetween. The heat exchanger is mounted on the base plate and connected to the liquid chamber.