Liquid Cooling Plate Flow Guide for Uniform Server Chip Temperatures
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Solution Overview
Problem
Existing liquid cooling solutions for high-performance computing servers fail to achieve temperature uniformity among various computing chips, leading to performance degradation and potential device malfunctions.
Innovation Solution
A liquid cooling plate with a flow guide structure and heat dissipation fins that distribute medium flow evenly across the width direction of the flow channel, using flow guide plates that protrude away from each other and vary in distance to ensure consistent flow velocity and temperature, reducing turbulence and enhancing heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If liquid cooling plates with heat dissipation fins are used, then heat dissipation capability is improved, but temperature uniformity across the width direction deteriorates
Solution Approach 1:
The flow channel is divided into multiple sub-flow channels by inserting heat dissipation fins, which segment the fluid flow to distribute cooling more evenly across different regions. This segmentation allows each sub-flow channel to serve specific heat generation zones, improving overall temperature uniformity while maintaining high heat dissipation capability through the fin structure.
Solution Approach 2:
Flow guide structures with varying gap dimensions are introduced at different locations within the flow channel. The gap dimension changes from the inlet toward the outlet, creating local variations in flow distribution. This local quality adjustment ensures that cooler regions receive appropriate flow rates while hotter regions receive sufficient cooling, achieving uniform temperature distribution across the width direction.
2Temperature
If flow guide structures with varying gap dimensions are introduced, then temperature uniformity is improved, but device complexity increases
Solution Approach 1:
The flow guide structure is merged with the heat dissipation fin assembly, combining two functional elements into a single integrated component. The flow guide plates are positioned between the inlet and the heat dissipation fins, forming a unified structure that simultaneously guides flow and provides heat dissipation. This merging reduces the number of separate parts and simplifies assembly while achieving the desired temperature uniformity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures consistent temperatures across the width of the flow channel, improving heat dissipation performance and extending the service life of hash chips by minimizing turbulence and maintaining uniformity.
Implementation Method 1
the liquid cooling plate includes a medium flow channel, heat dissipation fins, and a flow guide structure
Implementation Method 2
medium flow channel... heat dissipation fins... flow guide structure... distribute medium flow evenly
Data Source
AI summary
Disclosed is a liquid cooling plate for a computing server, a computing liquid cooling unit, a computing server, and a data center. The liquid cooling plate comprises a medium flow channel, heat dissipation fins, and a flow guide structure. The medium flow channel has channel end walls, wherein medium ports are arranged in the channel end walls. The heat dissipation fins are arranged within the medium flow channel and are disposed between the channel end walls, dividing the medium flow channel into a plurality of sub-flow channels. The flow guide structure is arranged at least between one of the channel end walls and the heat dissipation fins, and the flow guide structure is evenly spaced apart from the channel end wall on a side where the flow guide structure is disposed and from the heat dissipation fins.