Integrated Liquid Cooling Head for Compact Leak-Safe Heat Dissipation
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Solution Overview
Problem
Conventional liquid cooling mechanisms for electronic devices face challenges in compact installation and efficient heat dissipation due to complex pipeline configurations and space constraints within computer equipment and servers, requiring a design that enhances heat-dissipating efficacy while minimizing occupied space and preventing water leakage.
Innovation Solution
A liquid cooling module and head design featuring a chassis with a housing, blocking plate, and base, including inlet channels, a thermally-conducting structure, liquid gathering structure, and a pump set, which allows for efficient fluid flow and heat dissipation through a stacked chamber configuration and flow-diverting structures to manage fluid flow and prevent leakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional liquid cooling mechanisms are used with separate pipelines distributed on component surfaces, then heat dissipation can be achieved, but the installation space is excessively large and the piping system becomes complicated
Solution Approach 1:
The patent merges the upper chamber and lower chamber into a single integrated cooling head structure, with the thermally-conducting structure spanning both chambers. This consolidation eliminates the need for separate pipeline distributions on component surfaces, reducing the occupied space while maintaining heat dissipation functionality through the integrated fluid passage system.
Solution Approach 2:
The thermally-conducting structure is nested within the chassis, with the upper chamber and lower chamber stacked vertically. The blocking plate with connection opening nests between the two chambers, creating a compact nested arrangement that reduces the overall volume of the cooling system while preserving the heat transfer pathway.
2Temperature
If conventional liquid cooling mechanisms are used with separate pipelines distributed on component surfaces, then heat dissipation can be achieved, but the pipeline installation becomes relatively complicated
Solution Approach 1:
The patent combines the inlet channel and outlet channel into a single integrated cooling head structure, with fluid flowing sequentially through the upper chamber and lower chamber. This merging of pipeline functions into one unified component dramatically simplifies the overall pipeline configuration, eliminating the complexity of distributing multiple separate pipelines across component surfaces.
Solution Approach 2:
The cooling head structure serves multiple functions simultaneously: it provides thermal conduction through the thermally-conducting structure, houses both inlet and outlet channels, contains the upper and lower chambers for fluid circulation, and integrates the blocking plate for flow direction. This multi-functionality reduces the number of separate components needed, simplifying installation.
3Volume of moving object
If compact installation is pursued in narrow environments, then space is reduced, but connection and sealing become difficult leading to potential water leakage
Solution Approach 1:
The blocking plate is pre-configured with a connection opening that aligns the upper chamber and lower chamber before final assembly. This preliminary configuration ensures proper fluid flow path and sealing interface are established during assembly, reducing the risk of misalignment and leakage in compact installations.
Solution Approach 2:
By merging the upper chamber and lower chamber into a single integrated cooling head with internal flow passages, the patent eliminates multiple external connection points that would be prone to leakage. The unified structure reduces the number of seals and connections required, thereby improving reliability in compact environments.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves effective heat dissipation efficiency while reducing the occupied space of the piping system, facilitating easier installation in compact environments and preventing water leakage, thus enhancing the performance of computer and server equipment.
Implementation Method 1
The thermally-conducting structure is disposed within the lower chamber, and sandwiched between the blocking plate and the base for radiating the heat of the working fluid away
Implementation Method 2
The pump set pushes the working fluid in the lower chamber to discharge the working fluid outwards from the drain channel
Data Source
AI summary
A liquid cooling head includes a chassis, an inlet channel, a thermally-conducting structure, a liquid gathering structure, a drain channel and a pump set. The chassis includes a lower chamber and an upper chamber communicated with the lower chamber through a connection opening. The inlet channel is disposed on one side of the chassis, and communicated with the upper chamber for radiating the heat of the working fluid away. The thermally-conducting structure is disposed in the lower chamber for gathering the working fluid passed through the thermally-conducting structure. The drain channel is disposed on one side of the chassis to be communicated with the lower chamber. The pump set for pushing the working fluid in the lower chamber to discharge the working fluid outwards from the drain channel.