Liquid Cooling Plate With Side-by-Side Heat Pipes for CPU Cooling
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Solution Overview
Problem
Existing cold plates struggle to efficiently dissipate the increasing heat generated by CPUs due to limited heat conduction to the fins, leading to insufficient heat dissipation.
Innovation Solution
A liquid cooling plate assembly with heat pipes arranged side by side in the fluid chamber of the cold plate, thermally coupled to the fins, enhancing heat conduction and contact with coolant for improved heat exchange efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional cold plate with fins is used, then simple structure is maintained, but heat dissipation efficiency is insufficient for high-performance CPUs
Solution Approach 1:
The patent combines multiple heat pipes with the cold plate structure to form an integrated cooling system. The heat pipes are arranged side by side and thermally coupled to the fins, merging the heat conduction function of heat pipes with the heat dissipation function of the cold plate, thereby significantly improving heat dissipation efficiency while maintaining reasonable structural complexity
Solution Approach 2:
The heat pipes act as intermediary elements between the CPU heat source and the cold plate fins. They facilitate rapid and uniform heat transfer from the CPU to the fins, serving as a thermal bridge that overcomes the limitation of direct cold plate contact and enhances overall heat exchange efficiency
2Power
If CPU performance is increased, then computing power is improved, but heat generation increases beyond the cold plate's dissipation capability
Solution Approach 1:
The cooling system is segmented into multiple heat pipes arranged side by side, each responsible for conducting heat from specific regions of the CPU. This segmentation allows for more uniform heat distribution across the cold plate fins, preventing localized overheating and enabling the system to handle higher CPU power levels
Solution Approach 2:
The heat pipes utilize phase transition (evaporation and condensation of working fluid) to transfer heat efficiently from the CPU to the cold plate. This phase change mechanism enables rapid heat removal that can keep pace with increasing CPU power consumption and heat generation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The heat pipes facilitate rapid and uniform heat transfer to the fins, improving heat dissipation efficiency and reducing CPU operation temperature effectively.
Implementation Method 1
the heat pipes not only can rapidly and uniformly conduct heat absorbed by the plate body of the cold plate to the fins of the cold plate
Implementation Method 2
the heat pipes are located in the fluid chamber and thermally coupled to the fins, and the heat pipes are arranged side by side and are in thermal contact with one another
Implementation Method 3
the heat exchange efficiency between the coolant and the liquid cooling plate assembly can be improved
Data Source
AI summary
A liquid cooling plate assembly is configured to be in thermal contact with a first heat source and a second heat source. The liquid cooling plate assembly includes a cold plate and a plurality of heat pipes. The cold plate includes a plate body and a plurality of fins. The plate body is configured to be in thermal contact with the first heat source and the second heat source, the plate body has a fluid chamber and an inner bottom surface, the inner bottom surface is located at a bottom of the fluid chamber, and the fins protrude from the inner bottom surface. The heat pipes are located in the fluid chamber and thermally coupled to the fins, and the heat pipes are arranged side by side and are in thermal contact with one another.