Liquid Cooling Manifold With Cold Plates for Dense Server Components
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Solution Overview
Problem
Current cooling methods for memory sub-systems face challenges with high storage power density, leading to thermal issues, acoustic noise, and increased energy costs, with existing approaches limiting processor and memory power and requiring fan redundancy, which reduces performance and usable board footprint.
Innovation Solution
A liquid cooling manifold system utilizing liquid-cooled cold plates to cool processor, memory, and drive components, reducing noise and power requirements while supporting increased power consumption, and eliminating static pressure fans.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If liquid cooling manifold with cold plates is implemented, then cooling efficiency is improved and power consumption is reduced, but device complexity increases
Solution Approach 1:
The patent combines multiple cooling functions into a single integrated liquid cooling manifold that simultaneously cools processor, memory, and drive components through a unified liquid distribution system, reducing the number of separate cooling devices and connections required
Solution Approach 2:
The liquid cooling manifold serves multiple cooling purposes through its multiple outlets that distribute coolant to different components (processor component, memory component, drive component), allowing one device to perform multiple cooling functions that would otherwise require separate cooling systems
2Loss of energy
If liquid cooling manifold with cold plates is implemented, then cooling efficiency is improved and power consumption is reduced, but manufacturing complexity increases
Solution Approach 1:
The liquid cooling manifold is designed with multiple separate outlets that can be independently manufactured and then assembled together, allowing complex cooling functions to be achieved through modular assembly rather than monolithic manufacturing
Solution Approach 2:
The patent integrates multiple outlet structures into a single manifold body that can be manufactured as one piece or assembled from standardized components, simplifying the overall manufacturing process compared to creating multiple separate cooling devices
3Object-affected harmful factors
If fan redundancy is eliminated through liquid cooling, then acoustic noise is reduced, but device complexity increases
Solution Approach 1:
The patent replaces mechanical fan-based air cooling systems with a liquid cooling system that uses pumped fluid circulation, eliminating the need for noisy rotating fan components while providing more efficient heat removal from components
Solution Approach 2:
The invention employs hydraulic principles by using liquid coolant flowing through channels in the cold plates to transfer heat away from components, replacing pneumatic/mechanical fan systems with a fluid-based thermal management approach
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The liquid cooling manifold enhances cooling efficiency, allowing for higher processor and memory power usage, reduces noise, and minimizes system footprint, improving computation and data accessibility.
Implementation Method 1
A liquid cooling manifold system utilizing liquid-cooled cold plates to cool processor, memory, and drive components
Implementation Method 2
The liquid cooling manifold can cool the processor component, the memory component, and the drive component by liquid cooling the cold plate coupled to the processor component and the memory component, and by liquid cooling the cold plate coupled to the drive component
Data Source
AI summary
A method includes a liquid cooling manifold cooling a processor component of a system by liquid cooling a first cold plate coupled to the processor component, cooling a memory component of the system by liquid cooling the first cold plate coupled to the memory component, and a liquid cooling a drive component of the system by liquid cooling a second cold plate coupled to the drive component.