Liquid Cooling Module Replacing Fan in Server Chassis
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Solution Overview
Problem
Datacenter server chassis cooling systems face challenges in efficiently managing increased heat generated by upgraded computing resources, particularly when transitioning from air-cooled to liquid-cooled systems, as existing solutions lack sufficient redundancy and flexibility in cooling and power distribution.
Innovation Solution
The introduction of a cooling module that replaces fan modules in server chassis, incorporating liquid cooling connectors and manifolds to provide enhanced cooling resources and additional electrical power, allowing for increased computing capacity and redundancy, while also supporting advanced functionalities like turbo mode and overclocking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If liquid cooling connectors and manifolds are integrated into the cooling module, then cooling capacity and heat management efficiency are improved, but device complexity increases
Solution Approach 1:
The patent combines liquid cooling connectors, manifolds, and cooling channels into an integrated cooling module that replaces traditional fan modules. This merging of multiple cooling components into a single modular unit improves cooling capacity while managing complexity through standardization and integration.
Solution Approach 2:
The cooling module is designed as a universal component that can be installed in standard fan module bays, providing both cooling and power distribution functions. The manifold structure serves multiple cooling zones simultaneously, and the module supports both air-cooled and liquid-cooled configurations.
2Adaptability or versatility
If the cooling module replaces fan modules in existing chassis, then adaptability and flexibility are improved, but manufacturing precision requirements increase
Solution Approach 1:
The cooling module is designed to fit into standard fan module bays using conventional mounting mechanisms, enabling it to replace fan modules in existing chassis without requiring custom installations. This universal design approach improves adaptability while maintaining compatibility with standard manufacturing tolerances.
3Reliability
If redundancy is increased by adding multiple cooling modules, then reliability is improved, but device complexity and space requirements increase
Solution Approach 1:
The cooling system is divided into multiple independent modular cooling units, each capable of operating autonomously. This segmentation allows for easy configuration of redundant cooling paths where multiple modules can be installed in parallel, improving reliability while maintaining manageable system complexity through modular architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively increases the cooling and power capacity of server chassis, enabling efficient heat management and supporting increased computing resources, while providing flexibility in resource allocation and supporting advanced computing functionalities.
Implementation Method 1
a first liquid cooling connector configured to receive liquid from a heat exchanger
Data Source
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AI summary
Example implementations relate to cooling modules. In some examples, a cooling module, can include an enclosure to replace a fan module, a first liquid cooling connector to receive and return cooling resources to a heat exchanger, and a second liquid cooling connector to provide the cooling resources to a manifold.