Liquid Cooling Assembly With Opposed Ports for CPU Heat Dissipation

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Solution Overview

Problem

Conventional liquid-cooling systems are unable to efficiently match the increasing heat generated by advanced central processing units and graphic processing units, leading to potential damage from elevated internal temperatures.

Innovation Solution

A liquid cooling assembly with a base, cover, and connectors, where the cover has an inlet and outlet on opposite sides, forming an accommodation space with fins and baffles that enhance coolant flow and heat dissipation efficiency by optimizing coolant flow rates and heat exchange.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If conventional liquid-cooling systems are used, then the system structure is simple, but the heat dissipation efficiency is insufficient to match increasing heat from advanced processors

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoidsystem structure complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The cover is divided into multiple sections with inlet and outlet ports positioned at opposite sides, creating segmented coolant flow paths that systematically traverse the entire base surface, maximizing heat dissipation coverage while maintaining manageable structural complexity

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The coolant flow is transitioned from a single-direction or centralized pattern to a multi-dimensional flow pattern by positioning inlet and outlet at opposite sides, enabling coolant to traverse the base in extended paths that cover larger surface areas and improve thermal exchange efficiency

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Productivity

If the inlet and outlet are located at opposite sides of the cover, then the coolant flow path is extended and heat dissipation efficiency is improved, but the device complexity increases

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoidcover structure complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The cover structure serves multiple functions simultaneously: it provides structural support, guides coolant flow through its inlet-outlet configuration, and integrates with the base to form sealed accommodation spaces, thereby achieving enhanced heat dissipation without proportionally increasing complexity

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The assembly effectively dissipates heat from heat sources like central processing units, improving heat dissipation efficiency and preventing damage to electronic components.

Implementation Method 1

the coolant become more effective in dissipating heat from the base

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

the coolant become more effective in dissipating heat from the base and thereby improving the heat dissipation efficiency

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentUS12105567B2Liquid cooling assembly
Publication Date: 2024.10.01 INVENTEC PUDONG TECH CORPOARTION
  • US12105567B2 patent drawing
  • US12105567B2 patent drawing
  • US12105567B2 patent drawing

AI summary

This disclosure relates to a liquid cooling assembly that includes a base, a cover, a first connector, and a second connector. The cover is disposed on the base. The cover and the base together form an accommodation space therebetween. The cover has an inlet and an outlet respectively located at two opposite sides of the cover in a direction parallel to a longitudinal direction of the cover. The first connector is disposed to the inlet of the cover. The second connector is disposed to the outlet of the cover.